Semiconductor package and fabrication method thereof

A semiconductor package and a fabrication method thereof. The fabrication method of the semiconductor package includes: bonding a first semiconductor chip having opposite first acting surface and first non-acting surface to a load bearing part with the first acting surface by means of an adhesion layer; forming a wrapping layer that wraps the first semiconductor chip on the load bearing part; joining a substrate having opposite first surface and second surface to the wrapping layer with the first surface, the first surface of the substrate having a plurality of electrical connection pads; removing the load bearing part and the adhesion layer to expose the first acting surface of the first semiconductor chip; forming a plurality of through hole in the wrapping layer to expose the electrical connection pads of the substrate; and forming a first circuit layer on the wrapping layer, and forming conductive through holes in the through holes, the conductive through holes electrically connecting the first circuit layer with the electrical connection pads. The load bearing part can effectively overcome the problem of warping in an existing manufacturing process, and costs can be reduced.