Polycarbonate composition and application thereof
The invention relates to a polycarbonate composition and application thereof. The polycarbonate composition contains polycarbonate, phosphate compounds and a thermal conductivity filler. In the total amount, 100 wt% of the polycarbonate composition, the content of the polycarbonate is 30 wt% to 85 w...
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| creator | LEE SHUI CHIANG HENG-BO TAI CHIA-HON |
| description | The invention relates to a polycarbonate composition and application thereof. The polycarbonate composition contains polycarbonate, phosphate compounds and a thermal conductivity filler. In the total amount, 100 wt% of the polycarbonate composition, the content of the polycarbonate is 30 wt% to 85 wt%; the content of the phosphate compounds is 4 wt% to 15 wt%; and the content of the thermal conductivity filler is selected from a range greater than 10 wt% and smaller than 40 wt%, or a range greater than 40 wt% and smaller than 65 wt%. By regulating the contents of the phosphate compounds and the thermal conductivity filler, the polycarbonate composition has excellent thermal conductivity and flame resistance and is especially suitable for manufacturing moldings having thermal conductivity and flame resistance. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN104513468A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN104513468A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN104513468A3</originalsourceid><addsrcrecordid>eNrjZDAMyM-pTE4sSsrPSyxJVUjOzy3IL84syczPU0jMS1FILCjIyUxOBPNLMlKLUvPTeBhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJvLOfoYGJqaGxiZmFozExagDiDCxT</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Polycarbonate composition and application thereof</title><source>esp@cenet</source><creator>LEE SHUI ; CHIANG HENG-BO ; TAI CHIA-HON</creator><creatorcontrib>LEE SHUI ; CHIANG HENG-BO ; TAI CHIA-HON</creatorcontrib><description>The invention relates to a polycarbonate composition and application thereof. The polycarbonate composition contains polycarbonate, phosphate compounds and a thermal conductivity filler. In the total amount, 100 wt% of the polycarbonate composition, the content of the polycarbonate is 30 wt% to 85 wt%; the content of the phosphate compounds is 4 wt% to 15 wt%; and the content of the thermal conductivity filler is selected from a range greater than 10 wt% and smaller than 40 wt%, or a range greater than 40 wt% and smaller than 65 wt%. By regulating the contents of the phosphate compounds and the thermal conductivity filler, the polycarbonate composition has excellent thermal conductivity and flame resistance and is especially suitable for manufacturing moldings having thermal conductivity and flame resistance.</description><language>eng</language><subject>CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150415&DB=EPODOC&CC=CN&NR=104513468A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150415&DB=EPODOC&CC=CN&NR=104513468A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LEE SHUI</creatorcontrib><creatorcontrib>CHIANG HENG-BO</creatorcontrib><creatorcontrib>TAI CHIA-HON</creatorcontrib><title>Polycarbonate composition and application thereof</title><description>The invention relates to a polycarbonate composition and application thereof. The polycarbonate composition contains polycarbonate, phosphate compounds and a thermal conductivity filler. In the total amount, 100 wt% of the polycarbonate composition, the content of the polycarbonate is 30 wt% to 85 wt%; the content of the phosphate compounds is 4 wt% to 15 wt%; and the content of the thermal conductivity filler is selected from a range greater than 10 wt% and smaller than 40 wt%, or a range greater than 40 wt% and smaller than 65 wt%. By regulating the contents of the phosphate compounds and the thermal conductivity filler, the polycarbonate composition has excellent thermal conductivity and flame resistance and is especially suitable for manufacturing moldings having thermal conductivity and flame resistance.</description><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAMyM-pTE4sSsrPSyxJVUjOzy3IL84syczPU0jMS1FILCjIyUxOBPNLMlKLUvPTeBhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJvLOfoYGJqaGxiZmFozExagDiDCxT</recordid><startdate>20150415</startdate><enddate>20150415</enddate><creator>LEE SHUI</creator><creator>CHIANG HENG-BO</creator><creator>TAI CHIA-HON</creator><scope>EVB</scope></search><sort><creationdate>20150415</creationdate><title>Polycarbonate composition and application thereof</title><author>LEE SHUI ; CHIANG HENG-BO ; TAI CHIA-HON</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN104513468A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2015</creationdate><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>LEE SHUI</creatorcontrib><creatorcontrib>CHIANG HENG-BO</creatorcontrib><creatorcontrib>TAI CHIA-HON</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LEE SHUI</au><au>CHIANG HENG-BO</au><au>TAI CHIA-HON</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Polycarbonate composition and application thereof</title><date>2015-04-15</date><risdate>2015</risdate><abstract>The invention relates to a polycarbonate composition and application thereof. The polycarbonate composition contains polycarbonate, phosphate compounds and a thermal conductivity filler. In the total amount, 100 wt% of the polycarbonate composition, the content of the polycarbonate is 30 wt% to 85 wt%; the content of the phosphate compounds is 4 wt% to 15 wt%; and the content of the thermal conductivity filler is selected from a range greater than 10 wt% and smaller than 40 wt%, or a range greater than 40 wt% and smaller than 65 wt%. By regulating the contents of the phosphate compounds and the thermal conductivity filler, the polycarbonate composition has excellent thermal conductivity and flame resistance and is especially suitable for manufacturing moldings having thermal conductivity and flame resistance.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| title | Polycarbonate composition and application thereof |
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