MANUFACTURING METHOD OF MIRCO-ELECTRO-MECHANICAL SYSTEM DEVICE AND MIRCO-ELECTRO-MECHANICAL SYSTEM DEVICE MADE THEREBY
The invention provides a manufacturing method of a MEMS device, which includes: providing an integrated circuit device including a substrate and an electrical structure on the substrate, the electrical structure includes at least one sensing region and at least one first connection section; providin...
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| creator | CHEN KUAN-LIN LO CHIUNGNG |
| description | The invention provides a manufacturing method of a MEMS device, which includes: providing an integrated circuit device including a substrate and an electrical structure on the substrate, the electrical structure includes at least one sensing region and at least one first connection section; providing a structure layer, and forming at least one second connection section on the structure layer; bonding the at least one first connection section and the at least one second connection section; etching the structure layer for forming at least one movable structure, the movable structure being located at a position corresponding to a position of the sensing region, and the movable structure being connected to the at least one first connection section via the at least one second connection section; and thereafter, providing a cap to cover the movable structure and the sensing region, wherein the movable structure is not directly connected to the cap. |
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providing a structure layer, and forming at least one second connection section on the structure layer; bonding the at least one first connection section and the at least one second connection section; etching the structure layer for forming at least one movable structure, the movable structure being located at a position corresponding to a position of the sensing region, and the movable structure being connected to the at least one first connection section via the at least one second connection section; and thereafter, providing a cap to cover the movable structure and the sensing region, wherein the movable structure is not directly connected to the cap.</description><subject>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</subject><subject>MICROSTRUCTURAL TECHNOLOGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAQANAuDqL-w_kBAatFdDwvFxPoJZCmQqdSJE6ihYrf7-IHdHrLWxZfQd8apNRG568gnGzQEAyIixQU10wpBiVMFr0jrKHpmsQCmm-OGNDruVVQMyTLkS_dulg8hueUN39XxdZwIqvy-O7zNA73_Mqfnny5q6rytD8f8TDn_AAmbjli</recordid><startdate>20150318</startdate><enddate>20150318</enddate><creator>CHEN KUAN-LIN</creator><creator>LO CHIUNGNG</creator><scope>EVB</scope></search><sort><creationdate>20150318</creationdate><title>MANUFACTURING METHOD OF MIRCO-ELECTRO-MECHANICAL SYSTEM DEVICE AND MIRCO-ELECTRO-MECHANICAL SYSTEM DEVICE MADE THEREBY</title><author>CHEN KUAN-LIN ; 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| language | eng |
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| subjects | MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TRANSPORTING |
| title | MANUFACTURING METHOD OF MIRCO-ELECTRO-MECHANICAL SYSTEM DEVICE AND MIRCO-ELECTRO-MECHANICAL SYSTEM DEVICE MADE THEREBY |
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