Chip assembly configuration with densely packed optical interconnects
A chip assembly configuration includes a substrate with an integrated circuit on one side and a conversion mechanism on the other side. The integrated circuit and the conversion mechanism are electrically coupled by a short electrical transmission line through the substrate. Moreover, the conversion...
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| creator | SZE THERESA MCELFRESH DAVID K ANESHANSLEY NICHOLAS E HUANG DAWEI RAJ KANNAN |
| description | A chip assembly configuration includes a substrate with an integrated circuit on one side and a conversion mechanism on the other side. The integrated circuit and the conversion mechanism are electrically coupled by a short electrical transmission line through the substrate. Moreover, the conversion mechanism converts signals between an electrical and an optical domain, thereby allowing high-speed communication between the integrated circuit and other components and devices using optical communication (for example, in an optical fiber or an optical waveguide). |
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| subjects | OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS |
| title | Chip assembly configuration with densely packed optical interconnects |
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