Electronic device

The invention provides an electronic device. The electronic device includes: a wiring substrate; a plurality of device chips that are flip-chip mounted on an upper surface of the wiring substrate through bumps, have gaps which expose the bumps between the device chips and the upper surface of the wi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MOTOI YAMAUCHI, OSAMU KAWACHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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