Chip identification pads for identification of integrated circuits in an assembly

Chip identification pads for identification of integrated circuits in an assembly. In one example embodiment, an integrated circuit (IC) assembly includes a controller, a plurality of ICs, a shared communication bus connecting the controller to the plurality of ICs and configured to enable communica...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	EKKIZOGLOY LUKE M, MIAO JASON Y, KALOGERAKIS GEORGIOS, ROBINSON CURTIS B, DYBSETTER GERALD L
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING PHYSICS
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