Semiconductor module and semiconductor device
The purpose of the present invention is to obtain a semiconductor module with a configuration which reduces the load on a molding resin and allows for the semiconductor module to have an even more compact size while still being able to be fastened to an object. A semiconductor module (7) includes a...
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| creator | KITAI KIYOFUMI KAWAUCHI YUKI |
| description | The purpose of the present invention is to obtain a semiconductor module with a configuration which reduces the load on a molding resin and allows for the semiconductor module to have an even more compact size while still being able to be fastened to an object. A semiconductor module (7) includes a semiconductor element (1); a mounting frame (2) on which the semiconductor element (1) is mounted; a control board (5) on which a control component (14) for controlling the semiconductor element (1) is mounted; and a molding resin (8) that encapsulates the semiconductor element (1), the mounting frame (2), and the control board (5) together. The control board (5) has a fastening substrate part (5a) disposed thereon which is exposed from the molding resin (8) and is used to fasten the semiconductor module (7) to an object. |
| format | Patent |
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A semiconductor module (7) includes a semiconductor element (1); a mounting frame (2) on which the semiconductor element (1) is mounted; a control board (5) on which a control component (14) for controlling the semiconductor element (1) is mounted; and a molding resin (8) that encapsulates the semiconductor element (1), the mounting frame (2), and the control board (5) together. 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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | Semiconductor module and semiconductor device |
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