Three dimensional passive multi-component structures
Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to an interposer with an encapsulated third layer of components disposed between the first and second layers. The first layer can be configured to attach...
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| creator | KENYU TOJIMA ARNOLD SHAWN X MAYO SEAN A MULLINS SCOTT P THOMA JEFFREY M KIDD DOUGLAS P PYPER DENNIS R |
| description | Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to an interposer with an encapsulated third layer of components disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can couple signals between the components on the first and second layers. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN104205268A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN104205268A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN104205268A3</originalsourceid><addsrcrecordid>eNrjZDAJyShKTVVIycxNzSvOzM9LzFEoSCwuzixLVcgtzSnJ1E3Ozy3Iz0vNK1EoLikqTS4pLUot5mFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hgYmRgamRmYWjsbEqAEAjkYtqA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Three dimensional passive multi-component structures</title><source>esp@cenet</source><creator>KENYU TOJIMA ; ARNOLD SHAWN X ; MAYO SEAN A ; MULLINS SCOTT P ; THOMA JEFFREY M ; KIDD DOUGLAS P ; PYPER DENNIS R</creator><creatorcontrib>KENYU TOJIMA ; ARNOLD SHAWN X ; MAYO SEAN A ; MULLINS SCOTT P ; THOMA JEFFREY M ; KIDD DOUGLAS P ; PYPER DENNIS R</creatorcontrib><description>Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to an interposer with an encapsulated third layer of components disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can couple signals between the components on the first and second layers.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CAPACITORS ; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20141210&DB=EPODOC&CC=CN&NR=104205268A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20141210&DB=EPODOC&CC=CN&NR=104205268A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KENYU TOJIMA</creatorcontrib><creatorcontrib>ARNOLD SHAWN X</creatorcontrib><creatorcontrib>MAYO SEAN A</creatorcontrib><creatorcontrib>MULLINS SCOTT P</creatorcontrib><creatorcontrib>THOMA JEFFREY M</creatorcontrib><creatorcontrib>KIDD DOUGLAS P</creatorcontrib><creatorcontrib>PYPER DENNIS R</creatorcontrib><title>Three dimensional passive multi-component structures</title><description>Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to an interposer with an encapsulated third layer of components disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can couple signals between the components on the first and second layers.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CAPACITORS</subject><subject>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAJyShKTVVIycxNzSvOzM9LzFEoSCwuzixLVcgtzSnJ1E3Ozy3Iz0vNK1EoLikqTS4pLUot5mFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hgYmRgamRmYWjsbEqAEAjkYtqA</recordid><startdate>20141210</startdate><enddate>20141210</enddate><creator>KENYU TOJIMA</creator><creator>ARNOLD SHAWN X</creator><creator>MAYO SEAN A</creator><creator>MULLINS SCOTT P</creator><creator>THOMA JEFFREY M</creator><creator>KIDD DOUGLAS P</creator><creator>PYPER DENNIS R</creator><scope>EVB</scope></search><sort><creationdate>20141210</creationdate><title>Three dimensional passive multi-component structures</title><author>KENYU TOJIMA ; ARNOLD SHAWN X ; MAYO SEAN A ; MULLINS SCOTT P ; THOMA JEFFREY M ; KIDD DOUGLAS P ; PYPER DENNIS R</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN104205268A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2014</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CAPACITORS</topic><topic>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KENYU TOJIMA</creatorcontrib><creatorcontrib>ARNOLD SHAWN X</creatorcontrib><creatorcontrib>MAYO SEAN A</creatorcontrib><creatorcontrib>MULLINS SCOTT P</creatorcontrib><creatorcontrib>THOMA JEFFREY M</creatorcontrib><creatorcontrib>KIDD DOUGLAS P</creatorcontrib><creatorcontrib>PYPER DENNIS R</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KENYU TOJIMA</au><au>ARNOLD SHAWN X</au><au>MAYO SEAN A</au><au>MULLINS SCOTT P</au><au>THOMA JEFFREY M</au><au>KIDD DOUGLAS P</au><au>PYPER DENNIS R</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Three dimensional passive multi-component structures</title><date>2014-12-10</date><risdate>2014</risdate><abstract>Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to an interposer with an encapsulated third layer of components disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can couple signals between the components on the first and second layers.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | Three dimensional passive multi-component structures |
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