High-density adapter board based on aluminum anode oxidation technology and manufacturing method thereof
The invention discloses a high-density adapter board based on an aluminum anode oxidation technology and a manufacturing method thereof. The high-density adapter board comprises a micropunch aluminum substrate, a thin film interconnection layer and ball grid array (BGA) structures. The micropunch al...
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| creator | DING LEI WANG LICHUN YANG XUYI LIU MIFENG |
| description | The invention discloses a high-density adapter board based on an aluminum anode oxidation technology and a manufacturing method thereof. The high-density adapter board comprises a micropunch aluminum substrate, a thin film interconnection layer and ball grid array (BGA) structures. The micropunch aluminum substrate comprises porous aluminum structures, metal column arrays, aluminum buried interconnection layers and aluminum through columns. The manufacturing method includes the following steps: providing a surface polishing aluminum substrate, conducting porous anode oxidation to form the porous aluminum structure, forming the metal column array in holes of the porous aluminum structure, forming the aluminum buried interconnection layers and the aluminum through columns in the aluminum substrate to form the micropunch aluminum substrate, forming a thin film interconnection layer on the second surface of the micropunch aluminum substrate, and forming the BGA structures on the first surface of the micropunch al |
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The manufacturing method includes the following steps: providing a surface polishing aluminum substrate, conducting porous anode oxidation to form the porous aluminum structure, forming the metal column array in holes of the porous aluminum structure, forming the aluminum buried interconnection layers and the aluminum through columns in the aluminum substrate to form the micropunch aluminum substrate, forming a thin film interconnection layer on the second surface of the micropunch aluminum substrate, and forming the BGA structures on the first surface of the micropunch al</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20141210&DB=EPODOC&CC=CN&NR=104201163A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20141210&DB=EPODOC&CC=CN&NR=104201163A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DING LEI</creatorcontrib><creatorcontrib>WANG LICHUN</creatorcontrib><creatorcontrib>YANG XUYI</creatorcontrib><creatorcontrib>LIU MIFENG</creatorcontrib><title>High-density adapter board based on aluminum anode oxidation technology and manufacturing method thereof</title><description>The invention discloses a high-density adapter board based on an aluminum anode oxidation technology and a manufacturing method thereof. 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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | High-density adapter board based on aluminum anode oxidation technology and manufacturing method thereof |
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