Surface treating agent for no-outline electrolytic copper foils
The invention belongs to the technical field of electrolytic copper foil processing, and particularly relates to a surface treating agent for no-outline electrolytic copper foils. Every liter of surface treating agent water solution contains 0.5-2.0g of N-(beta-aminoethyl)-gamma-aminopropyltrimethox...
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| creator | SONG SHUPING WANG TIANTANG WANG XUEJIANG XU SHUMIN WANG QILING YANG XIANGKUI XU CE ZHAO DONG LIU JIANGUANG |
| description | The invention belongs to the technical field of electrolytic copper foil processing, and particularly relates to a surface treating agent for no-outline electrolytic copper foils. Every liter of surface treating agent water solution contains 0.5-2.0g of N-(beta-aminoethyl)-gamma-aminopropyltrimethoxysilane, 0.5-2.0g of N- vinylbenzyl-2-aminoethyl-3-aminopropyltrimethoxysilane hydrochloride and 0.1-0.4g of ethyl silicate. The surface treating agent has the advantages of simple components and accessible raw materials, and is convenient to use. When being sprayed on the surface of the no-outline copper foil, the surface treating agent can obviously enhance the peel strength of the no-outline copper foil on a high-frequency microwave circuit board, so that the peel strength of the no-outline copper foil on a polyamide resin or polytetrafluoroethylene substrate is greater than or equal to 0.6 N/mm. |
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Every liter of surface treating agent water solution contains 0.5-2.0g of N-(beta-aminoethyl)-gamma-aminopropyltrimethoxysilane, 0.5-2.0g of N- vinylbenzyl-2-aminoethyl-3-aminopropyltrimethoxysilane hydrochloride and 0.1-0.4g of ethyl silicate. The surface treating agent has the advantages of simple components and accessible raw materials, and is convenient to use. When being sprayed on the surface of the no-outline copper foil, the surface treating agent can obviously enhance the peel strength of the no-outline copper foil on a high-frequency microwave circuit board, so that the peel strength of the no-outline copper foil on a polyamide resin or polytetrafluoroethylene substrate is greater than or equal to 0.6 N/mm.</description><language>chi ; eng</language><subject>ADHESIVES ; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; CORRECTING FLUIDS ; DYES ; FILLING PASTES ; INKS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; PERFORMING OPERATIONS ; POLISHES ; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; SPRAYING OR ATOMISING IN GENERAL ; TRANSPORTING ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20141203&DB=EPODOC&CC=CN&NR=104177879A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20141203&DB=EPODOC&CC=CN&NR=104177879A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SONG SHUPING</creatorcontrib><creatorcontrib>WANG TIANTANG</creatorcontrib><creatorcontrib>WANG XUEJIANG</creatorcontrib><creatorcontrib>XU SHUMIN</creatorcontrib><creatorcontrib>WANG QILING</creatorcontrib><creatorcontrib>YANG XIANGKUI</creatorcontrib><creatorcontrib>XU CE</creatorcontrib><creatorcontrib>ZHAO DONG</creatorcontrib><creatorcontrib>LIU JIANGUANG</creatorcontrib><title>Surface treating agent for no-outline electrolytic copper foils</title><description>The invention belongs to the technical field of electrolytic copper foil processing, and particularly relates to a surface treating agent for no-outline electrolytic copper foils. 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Every liter of surface treating agent water solution contains 0.5-2.0g of N-(beta-aminoethyl)-gamma-aminopropyltrimethoxysilane, 0.5-2.0g of N- vinylbenzyl-2-aminoethyl-3-aminopropyltrimethoxysilane hydrochloride and 0.1-0.4g of ethyl silicate. The surface treating agent has the advantages of simple components and accessible raw materials, and is convenient to use. When being sprayed on the surface of the no-outline copper foil, the surface treating agent can obviously enhance the peel strength of the no-outline copper foil on a high-frequency microwave circuit board, so that the peel strength of the no-outline copper foil on a polyamide resin or polytetrafluoroethylene substrate is greater than or equal to 0.6 N/mm.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVES APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS DYES FILLING PASTES INKS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS POLISHES PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL TRANSPORTING USE OF MATERIALS THEREFOR WOODSTAINS |
| title | Surface treating agent for no-outline electrolytic copper foils |
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