Integrated circuits including integrated passive devices and methods of manufacture thereof

Embodiments of integrated passive devices (100, 1100) (e.g., metal insulator metal, or MIM, capacitors) and methods of their formation include depositing (206, 212) a composite electrode (120, 820) over a semiconductor substrate (300) (e.g., on a dielectric layer (112, 312) above the substrate surfa...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WAYNE R. BURGER, XIAOWEI REN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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