Resin foam and manufacturing method therefor
Provided is a resin foam having excellent dust resistance, even at high temperatures. The resin foam according to the first embodiment of the present invention is characterized by having a thickness recovery rate (23 DEG C, 1 minute, 50% compression), as defined below, of at least 70%, and a strain...
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| creator | KANADA MITSUHIRO OTA MIE KANDORI YUKO KOUNO YOSHINORI YASUDA HIRONORI |
| description | Provided is a resin foam having excellent dust resistance, even at high temperatures. The resin foam according to the first embodiment of the present invention is characterized by having a thickness recovery rate (23 DEG C, 1 minute, 50% compression), as defined below, of at least 70%, and a strain recovery rate (80 DEG C, 24 hours, 50% compression), as defined below, of at least 80%. Thickness recovery rate (23 DEG C, 1 minute, 50% compression): the ratio of the thickness 1 second after compression is stopped to the initial thickness, as found by compressing the resin foam to just 50% of the initial thickness thereof at 23 DEG C, maintaining the compression for 1 minute at 23 DEG C, and then stopping the compression. Strain recovery rate (80 DEG C, 24 hours, 50% compression): the ratio of recovered distance to compressed distance as found by compressing the resin foam to just 50% of the initial thickness thereof at 23 DEG C, maintaining the compression for 24 hours at 80 DEG C, returning the temperature to 2 |
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The resin foam according to the first embodiment of the present invention is characterized by having a thickness recovery rate (23 DEG C, 1 minute, 50% compression), as defined below, of at least 70%, and a strain recovery rate (80 DEG C, 24 hours, 50% compression), as defined below, of at least 80%. Thickness recovery rate (23 DEG C, 1 minute, 50% compression): the ratio of the thickness 1 second after compression is stopped to the initial thickness, as found by compressing the resin foam to just 50% of the initial thickness thereof at 23 DEG C, maintaining the compression for 1 minute at 23 DEG C, and then stopping the compression. Strain recovery rate (80 DEG C, 24 hours, 50% compression): the ratio of recovered distance to compressed distance as found by compressing the resin foam to just 50% of the initial thickness thereof at 23 DEG C, maintaining the compression for 24 hours at 80 DEG C, returning the temperature to 2</description><language>chi ; eng</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; GENERAL PROCESSES OF COMPOUNDING ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; WORKING-UP</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140416&DB=EPODOC&CC=CN&NR=103732663A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140416&DB=EPODOC&CC=CN&NR=103732663A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KANADA MITSUHIRO</creatorcontrib><creatorcontrib>OTA MIE</creatorcontrib><creatorcontrib>KANDORI YUKO</creatorcontrib><creatorcontrib>KOUNO YOSHINORI</creatorcontrib><creatorcontrib>YASUDA HIRONORI</creatorcontrib><title>Resin foam and manufacturing method therefor</title><description>Provided is a resin foam having excellent dust resistance, even at high temperatures. 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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP |
| title | Resin foam and manufacturing method therefor |
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