Sputtering magnetron and method for dynamically influencing the magnetic field
A sputtering magnetron for coating a substrate includes a target and a magnet system that can be displaced relative to one another. The magnet system forms a magnetic field that penetrates the target, and has a support apparatus, a support plate with magnets arranged thereon, and actuators. The supp...
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| creator | ROLF RANK HANS-JUERGEN HEINRICH SVEN HAEHNE |
| description | A sputtering magnetron for coating a substrate includes a target and a magnet system that can be displaced relative to one another. The magnet system forms a magnetic field that penetrates the target, and has a support apparatus, a support plate with magnets arranged thereon, and actuators. The support apparatus is connectable to the support plate by the actuators such that distance between the magnet system and the target can be set, at least in sections. A cooling circuit cools the magnet arrangement and the target by a coolant. A layer measuring device obtains data of layer properties of at least one layer deposited on the substrate. Magnet system controls evaluate the data obtained and generate manipulated variables employed as the input variables of the actuators. A method for dynamically influencing the magnetic field is also provided. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN103710673A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN103710673A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN103710673A3</originalsourceid><addsrcrecordid>eNrjZPALLigtKUktysxLV8hNTM9LLSnKz1NIzEtRyE0tychPUUjLL1JIqcxLzM1MTszJqVTIzEvLKU3NSwZpKMlIhWrKTFZIy0zNSeFhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqUDV8c5-hgbG5oYGZubGjsbEqAEAX742_g</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Sputtering magnetron and method for dynamically influencing the magnetic field</title><source>esp@cenet</source><creator>ROLF RANK ; HANS-JUERGEN HEINRICH ; SVEN HAEHNE</creator><creatorcontrib>ROLF RANK ; HANS-JUERGEN HEINRICH ; SVEN HAEHNE</creatorcontrib><description>A sputtering magnetron for coating a substrate includes a target and a magnet system that can be displaced relative to one another. The magnet system forms a magnetic field that penetrates the target, and has a support apparatus, a support plate with magnets arranged thereon, and actuators. The support apparatus is connectable to the support plate by the actuators such that distance between the magnet system and the target can be set, at least in sections. A cooling circuit cools the magnet arrangement and the target by a coolant. A layer measuring device obtains data of layer properties of at least one layer deposited on the substrate. Magnet system controls evaluate the data obtained and generate manipulated variables employed as the input variables of the actuators. A method for dynamically influencing the magnetic field is also provided.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140409&DB=EPODOC&CC=CN&NR=103710673A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25547,76298</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140409&DB=EPODOC&CC=CN&NR=103710673A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ROLF RANK</creatorcontrib><creatorcontrib>HANS-JUERGEN HEINRICH</creatorcontrib><creatorcontrib>SVEN HAEHNE</creatorcontrib><title>Sputtering magnetron and method for dynamically influencing the magnetic field</title><description>A sputtering magnetron for coating a substrate includes a target and a magnet system that can be displaced relative to one another. The magnet system forms a magnetic field that penetrates the target, and has a support apparatus, a support plate with magnets arranged thereon, and actuators. The support apparatus is connectable to the support plate by the actuators such that distance between the magnet system and the target can be set, at least in sections. A cooling circuit cools the magnet arrangement and the target by a coolant. A layer measuring device obtains data of layer properties of at least one layer deposited on the substrate. Magnet system controls evaluate the data obtained and generate manipulated variables employed as the input variables of the actuators. A method for dynamically influencing the magnetic field is also provided.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPALLigtKUktysxLV8hNTM9LLSnKz1NIzEtRyE0tychPUUjLL1JIqcxLzM1MTszJqVTIzEvLKU3NSwZpKMlIhWrKTFZIy0zNSeFhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqUDV8c5-hgbG5oYGZubGjsbEqAEAX742_g</recordid><startdate>20140409</startdate><enddate>20140409</enddate><creator>ROLF RANK</creator><creator>HANS-JUERGEN HEINRICH</creator><creator>SVEN HAEHNE</creator><scope>EVB</scope></search><sort><creationdate>20140409</creationdate><title>Sputtering magnetron and method for dynamically influencing the magnetic field</title><author>ROLF RANK ; HANS-JUERGEN HEINRICH ; SVEN HAEHNE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN103710673A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2014</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>ROLF RANK</creatorcontrib><creatorcontrib>HANS-JUERGEN HEINRICH</creatorcontrib><creatorcontrib>SVEN HAEHNE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ROLF RANK</au><au>HANS-JUERGEN HEINRICH</au><au>SVEN HAEHNE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Sputtering magnetron and method for dynamically influencing the magnetic field</title><date>2014-04-09</date><risdate>2014</risdate><abstract>A sputtering magnetron for coating a substrate includes a target and a magnet system that can be displaced relative to one another. The magnet system forms a magnetic field that penetrates the target, and has a support apparatus, a support plate with magnets arranged thereon, and actuators. The support apparatus is connectable to the support plate by the actuators such that distance between the magnet system and the target can be set, at least in sections. A cooling circuit cools the magnet arrangement and the target by a coolant. A layer measuring device obtains data of layer properties of at least one layer deposited on the substrate. Magnet system controls evaluate the data obtained and generate manipulated variables employed as the input variables of the actuators. A method for dynamically influencing the magnetic field is also provided.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | Sputtering magnetron and method for dynamically influencing the magnetic field |
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