Methods of bonding components for fabricating electronic assemblies and electronic assemblies including bonded components

Methods of bonding components for fabricating electronic assemblies and electronic assemblies including bonded components are provided herein. In one example, a method of bonding components for fabricating an electronic assembly comprises the steps of disposing a first layer of a first high temperat...

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Hauptverfasser:	ZHENG YUNQI, LE KHIET, SMITH GREGORY S, ROSDAHL GREGORY D, GROSU VICENTIU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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