Pit embedded circuit board three-dimensional assembling method

The invention provides a pit embedded circuit board three-dimensional assembling method, which has the advantages of being capable of obviously improving the three-dimensional assembling density of electronic products, reducing the size and the weight and realizing time sequence consistency of trans...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ZHENG GUOHONG, ZHENG DAAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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