Pit embedded circuit board three-dimensional assembling method

The invention provides a pit embedded circuit board three-dimensional assembling method, which has the advantages of being capable of obviously improving the three-dimensional assembling density of electronic products, reducing the size and the weight and realizing time sequence consistency of transmitting signals of paired used devices. The invention is realized in the following technical scheme that sunken pits for assembling components are designed and manufactured on a printed board, and the selected thin and small components are deployed in the sunken pits of the printed board; appropriate bridging devices are deployed right above the pits to form a pit-type device lamination three-dimensional assembled structural form; wiring in the printed board is carried out according to the circuit design, electrical signal transmission channels are laid among the devices, and are connected with the devices inside and outside the sunken parts through printed conductors on the printed board; patching is carried out o