Semiconductor device and method for manufacturing same

Semiconductor device and method for manufacturing same

The present invention relates to a semiconductor device and a method for making the same. The semiconductor device includes a substrate, a first redistribution layer and a conductive via. The substrate has a substrate body and a pad. The pad and the first redistribution layer are disposed adjacent t...

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Hauptverfasser: HSU CHIH-JING, OU YING-TE, FU CHIEHN, HUANG CHE-HAU
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator HSU CHIH-JING
OU YING-TE
FU CHIEHN
HUANG CHE-HAU
description The present invention relates to a semiconductor device and a method for making the same. The semiconductor device includes a substrate, a first redistribution layer and a conductive via. The substrate has a substrate body and a pad. The pad and the first redistribution layer are disposed adjacent to the first surface of the substrate body, and electrically connected to each other. The interconnection metal is disposed in a through hole of the substrate body, and contacts the first redistribution layer. Whereby, the pad can be electrically connected to the second surface of the substrate body through the first redistribution layer and the conductive via.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Semiconductor device and method for manufacturing same
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