A light emitting diode assembly and method for fabricating the same

The present invention is directed to a light emitting diode (LED) assembly and a method for fabricating the same. According to the present invention, there is provided an LED assembly comprising an LED comprising at least an N-type semiconductor layer and a P-type semiconductor layer; and bumps arra...

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Hauptverfasser: LEE KYU-HO, SUH DAE-WOONG, CHOI JAE-RYANG, KIM CHANG-HOON, XU DAXIONG, CUI ZAILIANG, JIN CHANGXUN
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creator LEE KYU-HO
SUH DAE-WOONG
CHOI JAE-RYANG
KIM CHANG-HOON
XU DAXIONG
CUI ZAILIANG
JIN CHANGXUN
description The present invention is directed to a light emitting diode (LED) assembly and a method for fabricating the same. According to the present invention, there is provided an LED assembly comprising an LED comprising at least an N-type semiconductor layer and a P-type semiconductor layer; and bumps arranged on the LED and electrically connected to the semiconductor layers, wherein the bump comprises a first region made of a gold (Au) compound including tin (Sn) and a second region made of gold.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN103238225A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN103238225A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN103238225A3</originalsourceid><addsrcrecordid>eNqNyr0KwjAUBtAsDqK-w-0DCJoguJagODm5l9vmSxPIT2nu4tsL4gM4neVsle0pxTkIIUeRWGZysToQt4Y8pjdxcZQhoTrydSXP4xon_k4JoMYZe7XxnBoOP3equ99e9nHEUge0hScUyGCf55PR5qr1pTf_nA80wDHZ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>A light emitting diode assembly and method for fabricating the same</title><source>esp@cenet</source><creator>LEE KYU-HO; SUH DAE-WOONG; CHOI JAE-RYANG; KIM CHANG-HOON ; XU DAXIONG ; CUI ZAILIANG ; JIN CHANGXUN</creator><creatorcontrib>LEE KYU-HO; SUH DAE-WOONG; CHOI JAE-RYANG; KIM CHANG-HOON ; XU DAXIONG ; CUI ZAILIANG ; JIN CHANGXUN</creatorcontrib><description>The present invention is directed to a light emitting diode (LED) assembly and a method for fabricating the same. According to the present invention, there is provided an LED assembly comprising an LED comprising at least an N-type semiconductor layer and a P-type semiconductor layer; and bumps arranged on the LED and electrically connected to the semiconductor layers, wherein the bump comprises a first region made of a gold (Au) compound including tin (Sn) and a second region made of gold.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130807&amp;DB=EPODOC&amp;CC=CN&amp;NR=103238225A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130807&amp;DB=EPODOC&amp;CC=CN&amp;NR=103238225A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LEE KYU-HO; SUH DAE-WOONG; CHOI JAE-RYANG; KIM CHANG-HOON</creatorcontrib><creatorcontrib>XU DAXIONG</creatorcontrib><creatorcontrib>CUI ZAILIANG</creatorcontrib><creatorcontrib>JIN CHANGXUN</creatorcontrib><title>A light emitting diode assembly and method for fabricating the same</title><description>The present invention is directed to a light emitting diode (LED) assembly and a method for fabricating the same. According to the present invention, there is provided an LED assembly comprising an LED comprising at least an N-type semiconductor layer and a P-type semiconductor layer; and bumps arranged on the LED and electrically connected to the semiconductor layers, wherein the bump comprises a first region made of a gold (Au) compound including tin (Sn) and a second region made of gold.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyr0KwjAUBtAsDqK-w-0DCJoguJagODm5l9vmSxPIT2nu4tsL4gM4neVsle0pxTkIIUeRWGZysToQt4Y8pjdxcZQhoTrydSXP4xon_k4JoMYZe7XxnBoOP3equ99e9nHEUge0hScUyGCf55PR5qr1pTf_nA80wDHZ</recordid><startdate>20130807</startdate><enddate>20130807</enddate><creator>LEE KYU-HO; SUH DAE-WOONG; CHOI JAE-RYANG; KIM CHANG-HOON</creator><creator>XU DAXIONG</creator><creator>CUI ZAILIANG</creator><creator>JIN CHANGXUN</creator><scope>EVB</scope></search><sort><creationdate>20130807</creationdate><title>A light emitting diode assembly and method for fabricating the same</title><author>LEE KYU-HO; SUH DAE-WOONG; CHOI JAE-RYANG; KIM CHANG-HOON ; XU DAXIONG ; CUI ZAILIANG ; JIN CHANGXUN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN103238225A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2013</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LEE KYU-HO; SUH DAE-WOONG; CHOI JAE-RYANG; KIM CHANG-HOON</creatorcontrib><creatorcontrib>XU DAXIONG</creatorcontrib><creatorcontrib>CUI ZAILIANG</creatorcontrib><creatorcontrib>JIN CHANGXUN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LEE KYU-HO; SUH DAE-WOONG; CHOI JAE-RYANG; KIM CHANG-HOON</au><au>XU DAXIONG</au><au>CUI ZAILIANG</au><au>JIN CHANGXUN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>A light emitting diode assembly and method for fabricating the same</title><date>2013-08-07</date><risdate>2013</risdate><abstract>The present invention is directed to a light emitting diode (LED) assembly and a method for fabricating the same. According to the present invention, there is provided an LED assembly comprising an LED comprising at least an N-type semiconductor layer and a P-type semiconductor layer; and bumps arranged on the LED and electrically connected to the semiconductor layers, wherein the bump comprises a first region made of a gold (Au) compound including tin (Sn) and a second region made of gold.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title A light emitting diode assembly and method for fabricating the same
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-03T01%3A32%3A01IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LEE%20KYU-HO;%20SUH%20DAE-WOONG;%20CHOI%20JAE-RYANG;%20KIM%20CHANG-HOON&rft.date=2013-08-07&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN103238225A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true