Hole wall metalizing process during production of ceramic shells
The invention discloses a hole wall metalizing process during production of ceramic shells. The hole wall metalizing process comprises the following steps: manufacturing a printing silk screen according to the position of small holes in a ceramic diaphragm; performing silk-screen printing on the cer...
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| creator | SHAO XUNDA XU RUIYUAN JIANG QUNWEI XU MENGJIAO LU WENXIA |
| description | The invention discloses a hole wall metalizing process during production of ceramic shells. The hole wall metalizing process comprises the following steps: manufacturing a printing silk screen according to the position of small holes in a ceramic diaphragm; performing silk-screen printing on the ceramic diaphragm by using tungsten pulp as a printing material of a silk-screen printing machine, aligning through holes of the printing silk screen with the small holes in the ceramic diaphragm during printing, and extruding the tungsten pulp into the small holes in the ceramic diaphragm from the through holes of the printing silk screen under the extrusion of a scraper of the silk-screen printing machine and filling the small holes; after the printing is finished, exhausting air from the small holes in the ceramic diaphragm, removing the tungsten pulp from the small holes in the ceramic diaphragm and remaining the tungsten pulp on the walls of the holes; and drying the tungsten pulp on the walls of the holes. The h |
| format | Patent |
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The hole wall metalizing process comprises the following steps: manufacturing a printing silk screen according to the position of small holes in a ceramic diaphragm; performing silk-screen printing on the ceramic diaphragm by using tungsten pulp as a printing material of a silk-screen printing machine, aligning through holes of the printing silk screen with the small holes in the ceramic diaphragm during printing, and extruding the tungsten pulp into the small holes in the ceramic diaphragm from the through holes of the printing silk screen under the extrusion of a scraper of the silk-screen printing machine and filling the small holes; after the printing is finished, exhausting air from the small holes in the ceramic diaphragm, removing the tungsten pulp from the small holes in the ceramic diaphragm and remaining the tungsten pulp on the walls of the holes; and drying the tungsten pulp on the walls of the holes. The h</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130703&DB=EPODOC&CC=CN&NR=103187316A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130703&DB=EPODOC&CC=CN&NR=103187316A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHAO XUNDA</creatorcontrib><creatorcontrib>XU RUIYUAN</creatorcontrib><creatorcontrib>JIANG QUNWEI</creatorcontrib><creatorcontrib>XU MENGJIAO</creatorcontrib><creatorcontrib>LU WENXIA</creatorcontrib><title>Hole wall metalizing process during production of ceramic shells</title><description>The invention discloses a hole wall metalizing process during production of ceramic shells. The hole wall metalizing process comprises the following steps: manufacturing a printing silk screen according to the position of small holes in a ceramic diaphragm; performing silk-screen printing on the ceramic diaphragm by using tungsten pulp as a printing material of a silk-screen printing machine, aligning through holes of the printing silk screen with the small holes in the ceramic diaphragm during printing, and extruding the tungsten pulp into the small holes in the ceramic diaphragm from the through holes of the printing silk screen under the extrusion of a scraper of the silk-screen printing machine and filling the small holes; after the printing is finished, exhausting air from the small holes in the ceramic diaphragm, removing the tungsten pulp from the small holes in the ceramic diaphragm and remaining the tungsten pulp on the walls of the holes; and drying the tungsten pulp on the walls of the holes. 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The hole wall metalizing process comprises the following steps: manufacturing a printing silk screen according to the position of small holes in a ceramic diaphragm; performing silk-screen printing on the ceramic diaphragm by using tungsten pulp as a printing material of a silk-screen printing machine, aligning through holes of the printing silk screen with the small holes in the ceramic diaphragm during printing, and extruding the tungsten pulp into the small holes in the ceramic diaphragm from the through holes of the printing silk screen under the extrusion of a scraper of the silk-screen printing machine and filling the small holes; after the printing is finished, exhausting air from the small holes in the ceramic diaphragm, removing the tungsten pulp from the small holes in the ceramic diaphragm and remaining the tungsten pulp on the walls of the holes; and drying the tungsten pulp on the walls of the holes. The h</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | Hole wall metalizing process during production of ceramic shells |
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