Insulated gate bipolar translator (IGBT) chip and manufacturing method of copper metallization structure on right side of IGBT chip

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Hauptverfasser: HUANG JIANWEI, LIU GUOYOU, TAN RONGZHEN
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN103165524BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN103165524BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN103165524BB3</originalsourceid><addsrcrecordid>eNqNjDsOwjAQRNNQIOAOKyookAghHCARnzRU9NFibxJLjm3Z64aWixMjDkAzo3l6mnn2bkyIGpkk9FPCUzmr0QN7NGHi1sOmuVaPLYhBOUAjYUQTOxQcvTI9jMSDlWA7ENY58gmg1uqFrKyBwD4mlWAaXvUDQ1CSkp9uv6_LbNahDrT69SJbX86P-rYjZ1sKDgUZ4ra-5_siP5Xl4VhVxV_SB0qLSfM</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Insulated gate bipolar translator (IGBT) chip and manufacturing method of copper metallization structure on right side of IGBT chip</title><source>esp@cenet</source><creator>HUANG JIANWEI ; LIU GUOYOU ; TAN RONGZHEN</creator><creatorcontrib>HUANG JIANWEI ; LIU GUOYOU ; TAN RONGZHEN</creatorcontrib><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20150715&amp;DB=EPODOC&amp;CC=CN&amp;NR=103165524B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20150715&amp;DB=EPODOC&amp;CC=CN&amp;NR=103165524B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HUANG JIANWEI</creatorcontrib><creatorcontrib>LIU GUOYOU</creatorcontrib><creatorcontrib>TAN RONGZHEN</creatorcontrib><title>Insulated gate bipolar translator (IGBT) chip and manufacturing method of copper metallization structure on right side of IGBT chip</title><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjDsOwjAQRNNQIOAOKyookAghHCARnzRU9NFibxJLjm3Z64aWixMjDkAzo3l6mnn2bkyIGpkk9FPCUzmr0QN7NGHi1sOmuVaPLYhBOUAjYUQTOxQcvTI9jMSDlWA7ENY58gmg1uqFrKyBwD4mlWAaXvUDQ1CSkp9uv6_LbNahDrT69SJbX86P-rYjZ1sKDgUZ4ra-5_siP5Xl4VhVxV_SB0qLSfM</recordid><startdate>20150715</startdate><enddate>20150715</enddate><creator>HUANG JIANWEI</creator><creator>LIU GUOYOU</creator><creator>TAN RONGZHEN</creator><scope>EVB</scope></search><sort><creationdate>20150715</creationdate><title>Insulated gate bipolar translator (IGBT) chip and manufacturing method of copper metallization structure on right side of IGBT chip</title><author>HUANG JIANWEI ; LIU GUOYOU ; TAN RONGZHEN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN103165524BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2015</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>HUANG JIANWEI</creatorcontrib><creatorcontrib>LIU GUOYOU</creatorcontrib><creatorcontrib>TAN RONGZHEN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HUANG JIANWEI</au><au>LIU GUOYOU</au><au>TAN RONGZHEN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Insulated gate bipolar translator (IGBT) chip and manufacturing method of copper metallization structure on right side of IGBT chip</title><date>2015-07-15</date><risdate>2015</risdate><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Insulated gate bipolar translator (IGBT) chip and manufacturing method of copper metallization structure on right side of IGBT chip
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-24T02%3A27%3A40IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HUANG%20JIANWEI&rft.date=2015-07-15&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN103165524BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true