Joining method and semiconductor device manufacturing method

A joining method that allows joining processing to be carried out simultaneously at a plurality of portions without being influenced by a supply time restriction on a joining material, and a semiconductor device manufacturing method using the joining method are provided. A chip and a lead frame are...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MUTO AYA, SHINKAI MASAYOSHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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