Joining method and semiconductor device manufacturing method

Joining method and semiconductor device manufacturing method

A joining method that allows joining processing to be carried out simultaneously at a plurality of portions without being influenced by a supply time restriction on a joining material, and a semiconductor device manufacturing method using the joining method are provided. A chip and a lead frame are...

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Hauptverfasser: MUTO AYA, SHINKAI MASAYOSHI
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator MUTO AYA
SHINKAI MASAYOSHI
description A joining method that allows joining processing to be carried out simultaneously at a plurality of portions without being influenced by a supply time restriction on a joining material, and a semiconductor device manufacturing method using the joining method are provided. A chip and a lead frame are tentatively assembled having a solid solder block interposed therebetween. The solder block is provided with protruding parts that protrude in one direction. The protruding parts are inserted into solder supply ports of the lead frame, whereby the chip and the lead frame are tentatively assembled. Subsequently, the chip and the lead frame are fed into a reflow oven, and the solder block is melted and thereafter solidified. Thus, the chip and the lead frame are joined to each other.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Joining method and semiconductor device manufacturing method
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