Method for preparing polyamide imide wire enamel
The invention discloses a method for preparing polyamide imide wire enamel. The method for preparing the polyamide imide wire enamel can be realized through reaction copolymerization at the temperature of 50-140 DEG C. The method for preparing the polyamide imide wire enamel is characterized in that...
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| creator | JIANG CHAOHUI LI AOLAN LEI JUN |
| description | The invention discloses a method for preparing polyamide imide wire enamel. The method for preparing the polyamide imide wire enamel can be realized through reaction copolymerization at the temperature of 50-140 DEG C. The method for preparing the polyamide imide wire enamel is characterized in that polyamide imide wire enamel comprises, by weight, 13-40 parts of aromatic polycarboxylic acid or acid of the aromatic polycarboxylic acid, 0.3-3 parts of catalyzer, 20-60 parts of mixed solvent, and 2.5-5 parts of polymerization inhibitor. According to the method for preparing the polyamide imide wire enamel, stability is good, good adhesiveness is achieved for copper conductors and a basic coating layer of general-used polyester or polyester imidogen, due to the fact that the viscosity of the polyamide imide wire enamel prepared with the method is lower than that of polyamide imide wire enamel prepared with a method using N-methyl pyrrolidone as solvent, and wire coating is convenient. Compared with an enamelled |
| format | Patent |
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The method for preparing the polyamide imide wire enamel can be realized through reaction copolymerization at the temperature of 50-140 DEG C. The method for preparing the polyamide imide wire enamel is characterized in that polyamide imide wire enamel comprises, by weight, 13-40 parts of aromatic polycarboxylic acid or acid of the aromatic polycarboxylic acid, 0.3-3 parts of catalyzer, 20-60 parts of mixed solvent, and 2.5-5 parts of polymerization inhibitor. According to the method for preparing the polyamide imide wire enamel, stability is good, good adhesiveness is achieved for copper conductors and a basic coating layer of general-used polyester or polyester imidogen, due to the fact that the viscosity of the polyamide imide wire enamel prepared with the method is lower than that of polyamide imide wire enamel prepared with a method using N-methyl pyrrolidone as solvent, and wire coating is convenient. 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The method for preparing the polyamide imide wire enamel can be realized through reaction copolymerization at the temperature of 50-140 DEG C. The method for preparing the polyamide imide wire enamel is characterized in that polyamide imide wire enamel comprises, by weight, 13-40 parts of aromatic polycarboxylic acid or acid of the aromatic polycarboxylic acid, 0.3-3 parts of catalyzer, 20-60 parts of mixed solvent, and 2.5-5 parts of polymerization inhibitor. According to the method for preparing the polyamide imide wire enamel, stability is good, good adhesiveness is achieved for copper conductors and a basic coating layer of general-used polyester or polyester imidogen, due to the fact that the viscosity of the polyamide imide wire enamel prepared with the method is lower than that of polyamide imide wire enamel prepared with a method using N-methyl pyrrolidone as solvent, and wire coating is convenient. 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The method for preparing the polyamide imide wire enamel can be realized through reaction copolymerization at the temperature of 50-140 DEG C. The method for preparing the polyamide imide wire enamel is characterized in that polyamide imide wire enamel comprises, by weight, 13-40 parts of aromatic polycarboxylic acid or acid of the aromatic polycarboxylic acid, 0.3-3 parts of catalyzer, 20-60 parts of mixed solvent, and 2.5-5 parts of polymerization inhibitor. According to the method for preparing the polyamide imide wire enamel, stability is good, good adhesiveness is achieved for copper conductors and a basic coating layer of general-used polyester or polyester imidogen, due to the fact that the viscosity of the polyamide imide wire enamel prepared with the method is lower than that of polyamide imide wire enamel prepared with a method using N-methyl pyrrolidone as solvent, and wire coating is convenient. Compared with an enamelled</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES FILLING PASTES INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS |
| title | Method for preparing polyamide imide wire enamel |
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