Electrolyte for removing tin on surface of copper rod
The invention discloses an electrolyte for removing tin on a surface of a copper rod. The electrolyte comprises the following components: 40-80 g/L of tin methane sulfonate, 20-40 g/L of 2-ethylenehydrinsulfonic acid, 120-150 g/L of methanesulfonic acid, 50-100 mg/L of gluconic acid, 2-4 mg/L of 2-e...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses an electrolyte for removing tin on a surface of a copper rod. The electrolyte comprises the following components: 40-80 g/L of tin methane sulfonate, 20-40 g/L of 2-ethylenehydrinsulfonic acid, 120-150 g/L of methanesulfonic acid, 50-100 mg/L of gluconic acid, 2-4 mg/L of 2-ethylenehydrinsulfonic acid silver, 40-60 mg/L of 1,3-dimethyl thiourea, 20-30 g/L of dimercaprol dimercaptopropanol, 10-20 mg/L of pyrogallic acid, 5-10 mg/L of sodium sorbate, 8-12 g/L of hexadecyl trimethyl ammonium bromide, 5-15 g/L of fatty alcohol-polyoxyethylene ether, 4-8 g/L of glycol, 3-6 mg/L of benzalacetone, 10-15 mg/L of nitrilotriacetic acid sodium, 5-8 g/L of sodium tripolyphosphate and the balance of de-ionized water. Compared with the traditional method, the electrolyte disclosed by the invention has a relatively simple requirement on an electrolysis condition, can plate tin in waste copper on a stainless steel plate in a short time, and has a fast plating speed and high production efficiency. |
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