Preparation process for adhesive coated foil adhesive with high resistance to stripping and dip soldering
The invention discloses a preparation process for an adhesive coated foil adhesive with high resistance to stripping and dip soldering. The preparation process comprises the following steps: a, blending 5 to 30 parts by mass of an epoxy resin and 1 to 20 parts by mass of a heterocyclic epoxy resin c...
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| creator | ZHANG JUN CHEN DINGMIAO |
| description | The invention discloses a preparation process for an adhesive coated foil adhesive with high resistance to stripping and dip soldering. The preparation process comprises the following steps: a, blending 5 to 30 parts by mass of an epoxy resin and 1 to 20 parts by mass of a heterocyclic epoxy resin curing agent at a temperature of 30 to 60 DEG C for 3 to 5 h to uniformly mix the epoxy resin and the curing agent; and b, blending a uniformly dispersed mixture obtained in step a with 50 to 300 parts by mass of a thermosetting phenolic resin and 50 to 350 parts by mass of a polyvinyl acetal resin at a temperature of 30 to 60 DEG C for 5 to 12 h so as to realize compounding, with 600 to 1000 parts of toluene used as a solvent. According to the preparation process disclosed in the invention, the appropriate heterocyclic epoxy resin curing agent and the epoxy resin are subjected to compounding and modification, so the problems of dissolution and dispersion of resins with different dissolvability in methanol are overc |
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The preparation process comprises the following steps: a, blending 5 to 30 parts by mass of an epoxy resin and 1 to 20 parts by mass of a heterocyclic epoxy resin curing agent at a temperature of 30 to 60 DEG C for 3 to 5 h to uniformly mix the epoxy resin and the curing agent; and b, blending a uniformly dispersed mixture obtained in step a with 50 to 300 parts by mass of a thermosetting phenolic resin and 50 to 350 parts by mass of a polyvinyl acetal resin at a temperature of 30 to 60 DEG C for 5 to 12 h so as to realize compounding, with 600 to 1000 parts of toluene used as a solvent. 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The preparation process comprises the following steps: a, blending 5 to 30 parts by mass of an epoxy resin and 1 to 20 parts by mass of a heterocyclic epoxy resin curing agent at a temperature of 30 to 60 DEG C for 3 to 5 h to uniformly mix the epoxy resin and the curing agent; and b, blending a uniformly dispersed mixture obtained in step a with 50 to 300 parts by mass of a thermosetting phenolic resin and 50 to 350 parts by mass of a polyvinyl acetal resin at a temperature of 30 to 60 DEG C for 5 to 12 h so as to realize compounding, with 600 to 1000 parts of toluene used as a solvent. 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The preparation process comprises the following steps: a, blending 5 to 30 parts by mass of an epoxy resin and 1 to 20 parts by mass of a heterocyclic epoxy resin curing agent at a temperature of 30 to 60 DEG C for 3 to 5 h to uniformly mix the epoxy resin and the curing agent; and b, blending a uniformly dispersed mixture obtained in step a with 50 to 300 parts by mass of a thermosetting phenolic resin and 50 to 350 parts by mass of a polyvinyl acetal resin at a temperature of 30 to 60 DEG C for 5 to 12 h so as to realize compounding, with 600 to 1000 parts of toluene used as a solvent. According to the preparation process disclosed in the invention, the appropriate heterocyclic epoxy resin curing agent and the epoxy resin are subjected to compounding and modification, so the problems of dissolution and dispersion of resins with different dissolvability in methanol are overc</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES |
| title | Preparation process for adhesive coated foil adhesive with high resistance to stripping and dip soldering |
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