Wafer level packaging method by using lead frame

Provided is a wafer level packaging method by using a lead frame. When being used for packaging two or a plurality of chips, a final product has a processed surface similar to a Quad flat No-lead (QFN). The final product will also have performance of matching or exceeding corresponding single chip....

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1. Verfasser:	A R ASHRAFZADEH
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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