Wafer level packaging method by using lead frame
Provided is a wafer level packaging method by using a lead frame. When being used for packaging two or a plurality of chips, a final product has a processed surface similar to a Quad flat No-lead (QFN). The final product will also have performance of matching or exceeding corresponding single chip....
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| creator | A R ASHRAFZADEH |
| description | Provided is a wafer level packaging method by using a lead frame. When being used for packaging two or a plurality of chips, a final product has a processed surface similar to a Quad flat No-lead (QFN). The final product will also have performance of matching or exceeding corresponding single chip. Two or a plurality of chips can be tightly connected, and the producing and processing process of each chip can be customized to be only suitable for the requirement of the chip. The wafer level packaging can be also used for packaging the single chip and can be used for packaging a chip having an active component and a plurality of chips having passive components on a second chip. |
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The final product will also have performance of matching or exceeding corresponding single chip. Two or a plurality of chips can be tightly connected, and the producing and processing process of each chip can be customized to be only suitable for the requirement of the chip. 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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Wafer level packaging method by using lead frame |
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