A splicing technique for fixed abrasives used in chemical mechanical planarization

An abrasive article includes a support pad, a first abrasive element, a second abrasive element and a fixation mechanism. The support pad has a first major surface, a second major surface, a first edge, a second edge and a channel. The channel is formed within the first major surface and extends fro...

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Bibliographische Detailangaben

1. Verfasser:	GAGLIARDI JOHN JAMES
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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