Equipotential temperature measuring device

Equipotential temperature measuring device

The invention discloses an equipotential temperature measuring device, which comprises a device main body, wherein a chamber is formed in the device main body; a cover is arranged on the chamber; a temperature measuring module is mounted in the chamber; the temperature measuring module comprises a c...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: REN WENZHAO
Format: Patent
Sprache:chi ; eng
Schlagworte:
MEASURING
MEASURING QUANTITY OF HEAT
MEASURING TEMPERATURE
PHYSICS
TESTING
THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator REN WENZHAO
description The invention discloses an equipotential temperature measuring device, which comprises a device main body, wherein a chamber is formed in the device main body; a cover is arranged on the chamber; a temperature measuring module is mounted in the chamber; the temperature measuring module comprises a circuit board and a temperature sensor; a through hole is formed in the cover; the temperature sensor is placed in the through hole; a grounding end cover is arranged on the temperature sensor; and a vertical sheet fixedly connected to the circuit board is arranged on the grounding end cover. According to the invention, as the grounding end cover is in contact with a detected article, the circuit board part and the detected article are effectively connected in an integrated way and a whole body is formed between the circuit board part and the detected article, as a result, interference of high voltage difference does not exist, the damages of electric stress to internal components are reduced and safety and reliabil
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN102914376BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN102914376BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN102914376BB3</originalsourceid><addsrcrecordid>eNrjZNByLSzNLMgvSc0ryUzMUShJzS1ILUosKS1KVchNTSwuLcrMS1dISS3LTE7lYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxzn6GBkaWhibG5mZOTsZEKQIA12kqSA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Equipotential temperature measuring device</title><source>esp@cenet</source><creator>REN WENZHAO</creator><creatorcontrib>REN WENZHAO</creatorcontrib><description>The invention discloses an equipotential temperature measuring device, which comprises a device main body, wherein a chamber is formed in the device main body; a cover is arranged on the chamber; a temperature measuring module is mounted in the chamber; the temperature measuring module comprises a circuit board and a temperature sensor; a through hole is formed in the cover; the temperature sensor is placed in the through hole; a grounding end cover is arranged on the temperature sensor; and a vertical sheet fixedly connected to the circuit board is arranged on the grounding end cover. According to the invention, as the grounding end cover is in contact with a detected article, the circuit board part and the detected article are effectively connected in an integrated way and a whole body is formed between the circuit board part and the detected article, as a result, interference of high voltage difference does not exist, the damages of electric stress to internal components are reduced and safety and reliabil</description><language>chi ; eng</language><subject>MEASURING ; MEASURING QUANTITY OF HEAT ; MEASURING TEMPERATURE ; PHYSICS ; TESTING ; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20141210&amp;DB=EPODOC&amp;CC=CN&amp;NR=102914376B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20141210&amp;DB=EPODOC&amp;CC=CN&amp;NR=102914376B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>REN WENZHAO</creatorcontrib><title>Equipotential temperature measuring device</title><description>The invention discloses an equipotential temperature measuring device, which comprises a device main body, wherein a chamber is formed in the device main body; a cover is arranged on the chamber; a temperature measuring module is mounted in the chamber; the temperature measuring module comprises a circuit board and a temperature sensor; a through hole is formed in the cover; the temperature sensor is placed in the through hole; a grounding end cover is arranged on the temperature sensor; and a vertical sheet fixedly connected to the circuit board is arranged on the grounding end cover. According to the invention, as the grounding end cover is in contact with a detected article, the circuit board part and the detected article are effectively connected in an integrated way and a whole body is formed between the circuit board part and the detected article, as a result, interference of high voltage difference does not exist, the damages of electric stress to internal components are reduced and safety and reliabil</description><subject>MEASURING</subject><subject>MEASURING QUANTITY OF HEAT</subject><subject>MEASURING TEMPERATURE</subject><subject>PHYSICS</subject><subject>TESTING</subject><subject>THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNByLSzNLMgvSc0ryUzMUShJzS1ILUosKS1KVchNTSwuLcrMS1dISS3LTE7lYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxzn6GBkaWhibG5mZOTsZEKQIA12kqSA</recordid><startdate>20141210</startdate><enddate>20141210</enddate><creator>REN WENZHAO</creator><scope>EVB</scope></search><sort><creationdate>20141210</creationdate><title>Equipotential temperature measuring device</title><author>REN WENZHAO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN102914376BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2014</creationdate><topic>MEASURING</topic><topic>MEASURING QUANTITY OF HEAT</topic><topic>MEASURING TEMPERATURE</topic><topic>PHYSICS</topic><topic>TESTING</topic><topic>THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR</topic><toplevel>online_resources</toplevel><creatorcontrib>REN WENZHAO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>REN WENZHAO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Equipotential temperature measuring device</title><date>2014-12-10</date><risdate>2014</risdate><abstract>The invention discloses an equipotential temperature measuring device, which comprises a device main body, wherein a chamber is formed in the device main body; a cover is arranged on the chamber; a temperature measuring module is mounted in the chamber; the temperature measuring module comprises a circuit board and a temperature sensor; a through hole is formed in the cover; the temperature sensor is placed in the through hole; a grounding end cover is arranged on the temperature sensor; and a vertical sheet fixedly connected to the circuit board is arranged on the grounding end cover. According to the invention, as the grounding end cover is in contact with a detected article, the circuit board part and the detected article are effectively connected in an integrated way and a whole body is formed between the circuit board part and the detected article, as a result, interference of high voltage difference does not exist, the damages of electric stress to internal components are reduced and safety and reliabil</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN102914376BB
source esp@cenet
subjects MEASURING
MEASURING QUANTITY OF HEAT
MEASURING TEMPERATURE
PHYSICS
TESTING
THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
title Equipotential temperature measuring device
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-04T13%3A37%3A10IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=REN%20WENZHAO&rft.date=2014-12-10&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN102914376BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true