Colloid nickel activation solution used for non-metal-based surface activation and preparation method thereof
The invention discloses colloid nickel activation solution used for non-metal-based surface activation, comprising the following components: 10-30g/L of NiCl2.6H2O, 10-20g/L of gelatine, 20-150g/L of hydrazine hydrate, 0.5-2g/L of OP-10 and the balance of deionized water. Colloid nickel is selected...
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| creator | XIE MINGGUI YAN HEGANG SU CHUANGANG SU CHUANMENG HE FANLI SU YANXUAN |
| description | The invention discloses colloid nickel activation solution used for non-metal-based surface activation, comprising the following components: 10-30g/L of NiCl2.6H2O, 10-20g/L of gelatine, 20-150g/L of hydrazine hydrate, 0.5-2g/L of OP-10 and the balance of deionized water. Colloid nickel is selected for substituting precious metals such as colloid palladium and colloid silver, and non-toxic hydrazine hydrate is selected as a reducing agent, so that the product cost is greatly reduced. The prepared colloid nickel particles are small, the activity is higher compared with the condition that a colloid copper activation solution is used when chemical copper deposition is carried out on an activation layer, and sodium hypophosphite is used as the reducing agent, so that safety and health hidden troubles caused by formaldehyde used in the traditional copper deposition process can be avoided; and a binding force between a non-metal base material which is subjected to activation with the activation solution and the che |
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Colloid nickel is selected for substituting precious metals such as colloid palladium and colloid silver, and non-toxic hydrazine hydrate is selected as a reducing agent, so that the product cost is greatly reduced. The prepared colloid nickel particles are small, the activity is higher compared with the condition that a colloid copper activation solution is used when chemical copper deposition is carried out on an activation layer, and sodium hypophosphite is used as the reducing agent, so that safety and health hidden troubles caused by formaldehyde used in the traditional copper deposition process can be avoided; and a binding force between a non-metal base material which is subjected to activation with the activation solution and the che</description><language>chi ; eng</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130206&DB=EPODOC&CC=CN&NR=102912327A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25551,76302</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130206&DB=EPODOC&CC=CN&NR=102912327A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>XIE MINGGUI</creatorcontrib><creatorcontrib>YAN HEGANG</creatorcontrib><creatorcontrib>SU CHUANGANG</creatorcontrib><creatorcontrib>SU CHUANMENG</creatorcontrib><creatorcontrib>HE FANLI</creatorcontrib><creatorcontrib>SU YANXUAN</creatorcontrib><title>Colloid nickel activation solution used for non-metal-based surface activation and preparation method thereof</title><description>The invention discloses colloid nickel activation solution used for non-metal-based surface activation, comprising the following components: 10-30g/L of NiCl2.6H2O, 10-20g/L of gelatine, 20-150g/L of hydrazine hydrate, 0.5-2g/L of OP-10 and the balance of deionized water. Colloid nickel is selected for substituting precious metals such as colloid palladium and colloid silver, and non-toxic hydrazine hydrate is selected as a reducing agent, so that the product cost is greatly reduced. The prepared colloid nickel particles are small, the activity is higher compared with the condition that a colloid copper activation solution is used when chemical copper deposition is carried out on an activation layer, and sodium hypophosphite is used as the reducing agent, so that safety and health hidden troubles caused by formaldehyde used in the traditional copper deposition process can be avoided; and a binding force between a non-metal base material which is subjected to activation with the activation solution and the che</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjDkOwjAQRd1QIOAOwwEskaRAlMgCUVHRR4M9Vqw4HssL5ycsBSXVX_T-X4pJsffsDASnR_KAurgHFscBMvv6NjWTAcsJAgc5UUEv7_jqck0WNf2OMBiIiSKmT57xgQ2UgRKxXYuFRZ9p89WV2J5PN3WRFLmnHOezQKVX12bXHpq2a_fH7h_mCcLJQsU</recordid><startdate>20130206</startdate><enddate>20130206</enddate><creator>XIE MINGGUI</creator><creator>YAN HEGANG</creator><creator>SU CHUANGANG</creator><creator>SU CHUANMENG</creator><creator>HE FANLI</creator><creator>SU YANXUAN</creator><scope>EVB</scope></search><sort><creationdate>20130206</creationdate><title>Colloid nickel activation solution used for non-metal-based surface activation and preparation method thereof</title><author>XIE MINGGUI ; YAN HEGANG ; SU CHUANGANG ; SU CHUANMENG ; HE FANLI ; SU YANXUAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN102912327A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2013</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>XIE MINGGUI</creatorcontrib><creatorcontrib>YAN HEGANG</creatorcontrib><creatorcontrib>SU CHUANGANG</creatorcontrib><creatorcontrib>SU CHUANMENG</creatorcontrib><creatorcontrib>HE FANLI</creatorcontrib><creatorcontrib>SU YANXUAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>XIE MINGGUI</au><au>YAN HEGANG</au><au>SU CHUANGANG</au><au>SU CHUANMENG</au><au>HE FANLI</au><au>SU YANXUAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Colloid nickel activation solution used for non-metal-based surface activation and preparation method thereof</title><date>2013-02-06</date><risdate>2013</risdate><abstract>The invention discloses colloid nickel activation solution used for non-metal-based surface activation, comprising the following components: 10-30g/L of NiCl2.6H2O, 10-20g/L of gelatine, 20-150g/L of hydrazine hydrate, 0.5-2g/L of OP-10 and the balance of deionized water. Colloid nickel is selected for substituting precious metals such as colloid palladium and colloid silver, and non-toxic hydrazine hydrate is selected as a reducing agent, so that the product cost is greatly reduced. The prepared colloid nickel particles are small, the activity is higher compared with the condition that a colloid copper activation solution is used when chemical copper deposition is carried out on an activation layer, and sodium hypophosphite is used as the reducing agent, so that safety and health hidden troubles caused by formaldehyde used in the traditional copper deposition process can be avoided; and a binding force between a non-metal base material which is subjected to activation with the activation solution and the che</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | Colloid nickel activation solution used for non-metal-based surface activation and preparation method thereof |
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