Flexible connection of substrate in power semiconductor module

The invention describes a power semiconductor module with at least two substrates (1). The substrates are arranged at a distance relative to each other, are respectively provided with at least a component(21,22,23,24) or respectively provided with at least a contact surface (20), and are electricall...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HOHLFELD OLAF, KIRSCH OLAF
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The invention describes a power semiconductor module with at least two substrates (1). The substrates are arranged at a distance relative to each other, are respectively provided with at least a component(21,22,23,24) or respectively provided with at least a contact surface (20), and are electrically and mechanically connected with each other by at least a layer (32). The layer (32) is attached on the substrates (1) to be connected so that the layer partially covers the substrates. The at least a component (21,22,23,24) and/or the at least a contact surface (20) exhibits a direct connection with one of the substrates (1) and is arranged between the respective substrates (1) and the layer(32).