Bonding process for sensitive micro- and nano-systems

A metal inter-diffusion bonding method comprises providing a stack of a first metal on a surface of both a first wafer and second wafer to be joined together. Said first metal is susceptible to oxidation in air. A layer of a second metal is provided on the first metal and has a melting point lower t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ELFING ANDERS, STARK BIRGER, HOIVIK NILS, WANG KAIYING
Format:	Patent
Sprache:	eng
Schlagworte:	MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TRANSPORTING
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