Silver-free copper based solder and preparation method thereof

Silver-free copper based solder and preparation method thereof

The invention relates to a silver-free copper based solder and a preparation method thereof, particularly to the silver-free copper based solder for soldering of compressor case covers and copper tubes. The silver-free copper based solder comprises, by weight, 56-68% of Cu, 29-38% of Zn, 0.5-8% of S...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: WANG XIAOYAN, WANG CAIYING, SHEN YANG, GE HONGQI
Format: Patent
Sprache:chi ; eng
Schlagworte:
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator WANG XIAOYAN
WANG CAIYING
SHEN YANG
GE HONGQI
description The invention relates to a silver-free copper based solder and a preparation method thereof, particularly to the silver-free copper based solder for soldering of compressor case covers and copper tubes. The silver-free copper based solder comprises, by weight, 56-68% of Cu, 29-38% of Zn, 0.5-8% of Sn, 0.5-8% of Mn, 0.1-2% of In and other microelements. The preparation method includes fully melting the Cu, the Sn, the Mn, the In and the other microelements to obtain a master alloy; adding Zn into the cooled master alloy with full stirring; taking the alloy out of a furnace; preparing an ingot through pouring; and preparing the ingot into solder wires through extrusion and drawing. The silver-free copper based solder and the preparation method thereof have the advantages that the soldering temperature is 815-865 DEG C and satisfies the process requirement, high silver based solders can be replaced, the cost is low, and the metallographic grain size after welding is low.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN102862003A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN102862003A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN102862003A3</originalsourceid><addsrcrecordid>eNrjZLALzswpSy3STStKTVVIzi8oSC1SSEosTk1RKM7PSQFyEvNSFAqKUgsSixJLMvPzFHJTSzLyUxRKMlKLUvPTeBhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJvLOfoYGRhZmRgYGxozExagBbQzCM</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Silver-free copper based solder and preparation method thereof</title><source>esp@cenet</source><creator>WANG XIAOYAN ; WANG CAIYING ; SHEN YANG ; GE HONGQI</creator><creatorcontrib>WANG XIAOYAN ; WANG CAIYING ; SHEN YANG ; GE HONGQI</creatorcontrib><description>The invention relates to a silver-free copper based solder and a preparation method thereof, particularly to the silver-free copper based solder for soldering of compressor case covers and copper tubes. The silver-free copper based solder comprises, by weight, 56-68% of Cu, 29-38% of Zn, 0.5-8% of Sn, 0.5-8% of Mn, 0.1-2% of In and other microelements. The preparation method includes fully melting the Cu, the Sn, the Mn, the In and the other microelements to obtain a master alloy; adding Zn into the cooled master alloy with full stirring; taking the alloy out of a furnace; preparing an ingot through pouring; and preparing the ingot into solder wires through extrusion and drawing. The silver-free copper based solder and the preparation method thereof have the advantages that the soldering temperature is 815-865 DEG C and satisfies the process requirement, high silver based solders can be replaced, the cost is low, and the metallographic grain size after welding is low.</description><language>chi ; eng</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130109&amp;DB=EPODOC&amp;CC=CN&amp;NR=102862003A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130109&amp;DB=EPODOC&amp;CC=CN&amp;NR=102862003A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WANG XIAOYAN</creatorcontrib><creatorcontrib>WANG CAIYING</creatorcontrib><creatorcontrib>SHEN YANG</creatorcontrib><creatorcontrib>GE HONGQI</creatorcontrib><title>Silver-free copper based solder and preparation method thereof</title><description>The invention relates to a silver-free copper based solder and a preparation method thereof, particularly to the silver-free copper based solder for soldering of compressor case covers and copper tubes. The silver-free copper based solder comprises, by weight, 56-68% of Cu, 29-38% of Zn, 0.5-8% of Sn, 0.5-8% of Mn, 0.1-2% of In and other microelements. The preparation method includes fully melting the Cu, the Sn, the Mn, the In and the other microelements to obtain a master alloy; adding Zn into the cooled master alloy with full stirring; taking the alloy out of a furnace; preparing an ingot through pouring; and preparing the ingot into solder wires through extrusion and drawing. The silver-free copper based solder and the preparation method thereof have the advantages that the soldering temperature is 815-865 DEG C and satisfies the process requirement, high silver based solders can be replaced, the cost is low, and the metallographic grain size after welding is low.</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLALzswpSy3STStKTVVIzi8oSC1SSEosTk1RKM7PSQFyEvNSFAqKUgsSixJLMvPzFHJTSzLyUxRKMlKLUvPTeBhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJvLOfoYGRhZmRgYGxozExagBbQzCM</recordid><startdate>20130109</startdate><enddate>20130109</enddate><creator>WANG XIAOYAN</creator><creator>WANG CAIYING</creator><creator>SHEN YANG</creator><creator>GE HONGQI</creator><scope>EVB</scope></search><sort><creationdate>20130109</creationdate><title>Silver-free copper based solder and preparation method thereof</title><author>WANG XIAOYAN ; WANG CAIYING ; SHEN YANG ; GE HONGQI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN102862003A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2013</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>WANG XIAOYAN</creatorcontrib><creatorcontrib>WANG CAIYING</creatorcontrib><creatorcontrib>SHEN YANG</creatorcontrib><creatorcontrib>GE HONGQI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WANG XIAOYAN</au><au>WANG CAIYING</au><au>SHEN YANG</au><au>GE HONGQI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Silver-free copper based solder and preparation method thereof</title><date>2013-01-09</date><risdate>2013</risdate><abstract>The invention relates to a silver-free copper based solder and a preparation method thereof, particularly to the silver-free copper based solder for soldering of compressor case covers and copper tubes. The silver-free copper based solder comprises, by weight, 56-68% of Cu, 29-38% of Zn, 0.5-8% of Sn, 0.5-8% of Mn, 0.1-2% of In and other microelements. The preparation method includes fully melting the Cu, the Sn, the Mn, the In and the other microelements to obtain a master alloy; adding Zn into the cooled master alloy with full stirring; taking the alloy out of a furnace; preparing an ingot through pouring; and preparing the ingot into solder wires through extrusion and drawing. The silver-free copper based solder and the preparation method thereof have the advantages that the soldering temperature is 815-865 DEG C and satisfies the process requirement, high silver based solders can be replaced, the cost is low, and the metallographic grain size after welding is low.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN102862003A
source esp@cenet
subjects CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
title Silver-free copper based solder and preparation method thereof
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-24T23%3A57%3A30IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=WANG%20XIAOYAN&rft.date=2013-01-09&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN102862003A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true