Device for SMT (surface mount technology) preprocessing of POP (package on package) devices

Device for SMT (surface mount technology) preprocessing of POP (package on package) devices

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: LIANG JINXIAN
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator LIANG JINXIAN
description
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN102858096BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN102858096BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN102858096BB3</originalsourceid><addsrcrecordid>eNrjZIh2SS3LTE5VSMsvUgj2DVHQKC4tSksECuTml-aVKJSkJmfk5efkp1dqKhQUpRYU5SenFhdn5qUr5KcpBPgHKGgUJCZnJ6anKuTnKUCZmgopYDOLeRhY0xJzilN5oTQ3g5Kba4izh25qQX58ajFQeWpeakm8s5-hgZGFqYWBpZmTkzFRigAVlzp9</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Device for SMT (surface mount technology) preprocessing of POP (package on package) devices</title><source>esp@cenet</source><creator>LIANG JINXIAN</creator><creatorcontrib>LIANG JINXIAN</creatorcontrib><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20150408&amp;DB=EPODOC&amp;CC=CN&amp;NR=102858096B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25568,76551</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20150408&amp;DB=EPODOC&amp;CC=CN&amp;NR=102858096B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIANG JINXIAN</creatorcontrib><title>Device for SMT (surface mount technology) preprocessing of POP (package on package) devices</title><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIh2SS3LTE5VSMsvUgj2DVHQKC4tSksECuTml-aVKJSkJmfk5efkp1dqKhQUpRYU5SenFhdn5qUr5KcpBPgHKGgUJCZnJ6anKuTnKUCZmgopYDOLeRhY0xJzilN5oTQ3g5Kba4izh25qQX58ajFQeWpeakm8s5-hgZGFqYWBpZmTkzFRigAVlzp9</recordid><startdate>20150408</startdate><enddate>20150408</enddate><creator>LIANG JINXIAN</creator><scope>EVB</scope></search><sort><creationdate>20150408</creationdate><title>Device for SMT (surface mount technology) preprocessing of POP (package on package) devices</title><author>LIANG JINXIAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN102858096BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2015</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>LIANG JINXIAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIANG JINXIAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Device for SMT (surface mount technology) preprocessing of POP (package on package) devices</title><date>2015-04-08</date><risdate>2015</risdate><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_CN102858096BB
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Device for SMT (surface mount technology) preprocessing of POP (package on package) devices
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-17T04%3A33%3A33IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LIANG%20JINXIAN&rft.date=2015-04-08&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN102858096BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true