Method for producing semiconductor film and semiconductor film

The embodiment of the invention discloses a method for producing a semiconductor film. The method comprises the steps of: obtaining a substrate material; producing a gallium nitride layer on the substrate material; and producing an aluminium-gallium-nitrogen layer on the gallium nitride layer, and e...

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Hauptverfasser: JIANG YADONG, LI SHIBIN, WU ZHIMING, XIAO ZHANFEI
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creator JIANG YADONG
LI SHIBIN
WU ZHIMING
XIAO ZHANFEI
description The embodiment of the invention discloses a method for producing a semiconductor film. The method comprises the steps of: obtaining a substrate material; producing a gallium nitride layer on the substrate material; and producing an aluminium-gallium-nitrogen layer on the gallium nitride layer, and enabling the aluminium content in the aluminium-gallium-nitrogen layer to linearly change from the part which is close to the aluminium-gallium-nitrogen layer to the part which is far away from the aluminium-gallium-nitrogen layer. According to the semiconductor film disclosed by the embodiment of the invention, an internal polarization electric field can be structured through the polarization effect difference and the polarization intensity difference of gallium nitride and aluminium nitride, and can also absorb charge carriers in a substrate into the electric field, and thus, the doping with ultrahigh charge carrier concentration is realized. The method is controllable to operate, and simple and feasible, has good
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN102800571A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN102800571A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN102800571A3</originalsourceid><addsrcrecordid>eNrjZLDzTS3JyE9RSMsvUigoyk8pTc7MS1coTs3NTM7PA_JKgOJpmTm5Col5KViEeRhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJvLOfoYGRhYGBqbmhozExagCHjTDp</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method for producing semiconductor film and semiconductor film</title><source>esp@cenet</source><creator>JIANG YADONG ; LI SHIBIN ; WU ZHIMING ; XIAO ZHANFEI</creator><creatorcontrib>JIANG YADONG ; LI SHIBIN ; WU ZHIMING ; XIAO ZHANFEI</creatorcontrib><description>The embodiment of the invention discloses a method for producing a semiconductor film. The method comprises the steps of: obtaining a substrate material; producing a gallium nitride layer on the substrate material; and producing an aluminium-gallium-nitrogen layer on the gallium nitride layer, and enabling the aluminium content in the aluminium-gallium-nitrogen layer to linearly change from the part which is close to the aluminium-gallium-nitrogen layer to the part which is far away from the aluminium-gallium-nitrogen layer. According to the semiconductor film disclosed by the embodiment of the invention, an internal polarization electric field can be structured through the polarization effect difference and the polarization intensity difference of gallium nitride and aluminium nitride, and can also absorb charge carriers in a substrate into the electric field, and thus, the doping with ultrahigh charge carrier concentration is realized. The method is controllable to operate, and simple and feasible, has good</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20121128&amp;DB=EPODOC&amp;CC=CN&amp;NR=102800571A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20121128&amp;DB=EPODOC&amp;CC=CN&amp;NR=102800571A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JIANG YADONG</creatorcontrib><creatorcontrib>LI SHIBIN</creatorcontrib><creatorcontrib>WU ZHIMING</creatorcontrib><creatorcontrib>XIAO ZHANFEI</creatorcontrib><title>Method for producing semiconductor film and semiconductor film</title><description>The embodiment of the invention discloses a method for producing a semiconductor film. The method comprises the steps of: obtaining a substrate material; producing a gallium nitride layer on the substrate material; and producing an aluminium-gallium-nitrogen layer on the gallium nitride layer, and enabling the aluminium content in the aluminium-gallium-nitrogen layer to linearly change from the part which is close to the aluminium-gallium-nitrogen layer to the part which is far away from the aluminium-gallium-nitrogen layer. According to the semiconductor film disclosed by the embodiment of the invention, an internal polarization electric field can be structured through the polarization effect difference and the polarization intensity difference of gallium nitride and aluminium nitride, and can also absorb charge carriers in a substrate into the electric field, and thus, the doping with ultrahigh charge carrier concentration is realized. The method is controllable to operate, and simple and feasible, has good</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2012</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLDzTS3JyE9RSMsvUigoyk8pTc7MS1coTs3NTM7PA_JKgOJpmTm5Col5KViEeRhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJvLOfoYGRhYGBqbmhozExagCHjTDp</recordid><startdate>20121128</startdate><enddate>20121128</enddate><creator>JIANG YADONG</creator><creator>LI SHIBIN</creator><creator>WU ZHIMING</creator><creator>XIAO ZHANFEI</creator><scope>EVB</scope></search><sort><creationdate>20121128</creationdate><title>Method for producing semiconductor film and semiconductor film</title><author>JIANG YADONG ; LI SHIBIN ; WU ZHIMING ; XIAO ZHANFEI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN102800571A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2012</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>JIANG YADONG</creatorcontrib><creatorcontrib>LI SHIBIN</creatorcontrib><creatorcontrib>WU ZHIMING</creatorcontrib><creatorcontrib>XIAO ZHANFEI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JIANG YADONG</au><au>LI SHIBIN</au><au>WU ZHIMING</au><au>XIAO ZHANFEI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for producing semiconductor film and semiconductor film</title><date>2012-11-28</date><risdate>2012</risdate><abstract>The embodiment of the invention discloses a method for producing a semiconductor film. The method comprises the steps of: obtaining a substrate material; producing a gallium nitride layer on the substrate material; and producing an aluminium-gallium-nitrogen layer on the gallium nitride layer, and enabling the aluminium content in the aluminium-gallium-nitrogen layer to linearly change from the part which is close to the aluminium-gallium-nitrogen layer to the part which is far away from the aluminium-gallium-nitrogen layer. According to the semiconductor film disclosed by the embodiment of the invention, an internal polarization electric field can be structured through the polarization effect difference and the polarization intensity difference of gallium nitride and aluminium nitride, and can also absorb charge carriers in a substrate into the electric field, and thus, the doping with ultrahigh charge carrier concentration is realized. The method is controllable to operate, and simple and feasible, has good</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Method for producing semiconductor film and semiconductor film
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-13T21%3A54%3A32IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=JIANG%20YADONG&rft.date=2012-11-28&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN102800571A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true