Epoxy waterproof system

The invention provides an epoxy waterproof system which comprises bisphenol A epoxy resin and bisphenol F epoxy resin, wherein based on the weight, the content of the bisphenol A epoxy resin is 20-30 percent, and the content of the bisphenol F epoxy resin is 5-10 percent. The epoxy waterproof system...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SUN LEI, FENG PEIQUAN, YU JIGUANG, JIANG SHUANGHE, HUANG CHEN, SUN QIAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!