Ultrasonic machining device and machining method for diamond microporous wire-drawing die

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Hauptverfasser: HUANG JIANYU, CAO FENGGUO, HU JIANGMEI
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CAO FENGGUO
HU JIANGMEI
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subjects DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
title Ultrasonic machining device and machining method for diamond microporous wire-drawing die
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