Equipment and operation method for improving rapid thermal processing productivity of wafers
The invention discloses equipment and an operation method for improving the rapid thermal processing productivity of wafers. The equipment includes at least one processing procedure module, a base body, a front end control interface and a rear end control interface, wherein each processing procedure...
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| creator | LIN WULANG ZHENG HUANGYU SHI YUGUANG ZHOU MINGYUAN LV XUELI GUO MINGLUN HUANG WENTAI |
| description | The invention discloses equipment and an operation method for improving the rapid thermal processing productivity of wafers. The equipment includes at least one processing procedure module, a base body, a front end control interface and a rear end control interface, wherein each processing procedure module includes at least one processing procedure cavity, a loading end, an unloading end, a mechanical arm and a cooling device; the loading end and the unloading end are combined-type cassettes used for accommodating multiple-piece graphite bearing plates in a layered manner; and the multiple-piece graphite bearing plates are provided with carving grooves, so as to load wafers of various sizes. The cassettes are designed to be the multiple-piece graphite bearing plates capable of accommodating and loading wafers, so that operation of the mechanical arm during the processing procedure is reduced, and rapid thermal processing for a plurality of wafers can be performed at the same time, the productivity in unit tim |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN102651328A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN102651328A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN102651328A3</originalsourceid><addsrcrecordid>eNqNijEKwkAQRdNYiHqH8QCCSVDSSohYWVkKYcjOmoHszro7iXh7I3gAq_947y-ze_McOTjyCugNSKCIyuLBkfZiwEoEdiHKxP4BEQMb0J6iwwFm21FK3zCjGTvlifUNYuGFlmJaZwuLQ6LNb1fZ9tzc6suOgrSUAnbkSdv6mu-L4yEvi-pU_vP5AC3vPMc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Equipment and operation method for improving rapid thermal processing productivity of wafers</title><source>esp@cenet</source><creator>LIN WULANG ; ZHENG HUANGYU ; SHI YUGUANG ; ZHOU MINGYUAN ; LV XUELI ; GUO MINGLUN ; HUANG WENTAI</creator><creatorcontrib>LIN WULANG ; ZHENG HUANGYU ; SHI YUGUANG ; ZHOU MINGYUAN ; LV XUELI ; GUO MINGLUN ; HUANG WENTAI</creatorcontrib><description>The invention discloses equipment and an operation method for improving the rapid thermal processing productivity of wafers. The equipment includes at least one processing procedure module, a base body, a front end control interface and a rear end control interface, wherein each processing procedure module includes at least one processing procedure cavity, a loading end, an unloading end, a mechanical arm and a cooling device; the loading end and the unloading end are combined-type cassettes used for accommodating multiple-piece graphite bearing plates in a layered manner; and the multiple-piece graphite bearing plates are provided with carving grooves, so as to load wafers of various sizes. The cassettes are designed to be the multiple-piece graphite bearing plates capable of accommodating and loading wafers, so that operation of the mechanical arm during the processing procedure is reduced, and rapid thermal processing for a plurality of wafers can be performed at the same time, the productivity in unit tim</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120829&DB=EPODOC&CC=CN&NR=102651328A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120829&DB=EPODOC&CC=CN&NR=102651328A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIN WULANG</creatorcontrib><creatorcontrib>ZHENG HUANGYU</creatorcontrib><creatorcontrib>SHI YUGUANG</creatorcontrib><creatorcontrib>ZHOU MINGYUAN</creatorcontrib><creatorcontrib>LV XUELI</creatorcontrib><creatorcontrib>GUO MINGLUN</creatorcontrib><creatorcontrib>HUANG WENTAI</creatorcontrib><title>Equipment and operation method for improving rapid thermal processing productivity of wafers</title><description>The invention discloses equipment and an operation method for improving the rapid thermal processing productivity of wafers. The equipment includes at least one processing procedure module, a base body, a front end control interface and a rear end control interface, wherein each processing procedure module includes at least one processing procedure cavity, a loading end, an unloading end, a mechanical arm and a cooling device; the loading end and the unloading end are combined-type cassettes used for accommodating multiple-piece graphite bearing plates in a layered manner; and the multiple-piece graphite bearing plates are provided with carving grooves, so as to load wafers of various sizes. The cassettes are designed to be the multiple-piece graphite bearing plates capable of accommodating and loading wafers, so that operation of the mechanical arm during the processing procedure is reduced, and rapid thermal processing for a plurality of wafers can be performed at the same time, the productivity in unit tim</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2012</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNijEKwkAQRdNYiHqH8QCCSVDSSohYWVkKYcjOmoHszro7iXh7I3gAq_947y-ze_McOTjyCugNSKCIyuLBkfZiwEoEdiHKxP4BEQMb0J6iwwFm21FK3zCjGTvlifUNYuGFlmJaZwuLQ6LNb1fZ9tzc6suOgrSUAnbkSdv6mu-L4yEvi-pU_vP5AC3vPMc</recordid><startdate>20120829</startdate><enddate>20120829</enddate><creator>LIN WULANG</creator><creator>ZHENG HUANGYU</creator><creator>SHI YUGUANG</creator><creator>ZHOU MINGYUAN</creator><creator>LV XUELI</creator><creator>GUO MINGLUN</creator><creator>HUANG WENTAI</creator><scope>EVB</scope></search><sort><creationdate>20120829</creationdate><title>Equipment and operation method for improving rapid thermal processing productivity of wafers</title><author>LIN WULANG ; ZHENG HUANGYU ; SHI YUGUANG ; ZHOU MINGYUAN ; LV XUELI ; GUO MINGLUN ; HUANG WENTAI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN102651328A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2012</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LIN WULANG</creatorcontrib><creatorcontrib>ZHENG HUANGYU</creatorcontrib><creatorcontrib>SHI YUGUANG</creatorcontrib><creatorcontrib>ZHOU MINGYUAN</creatorcontrib><creatorcontrib>LV XUELI</creatorcontrib><creatorcontrib>GUO MINGLUN</creatorcontrib><creatorcontrib>HUANG WENTAI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIN WULANG</au><au>ZHENG HUANGYU</au><au>SHI YUGUANG</au><au>ZHOU MINGYUAN</au><au>LV XUELI</au><au>GUO MINGLUN</au><au>HUANG WENTAI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Equipment and operation method for improving rapid thermal processing productivity of wafers</title><date>2012-08-29</date><risdate>2012</risdate><abstract>The invention discloses equipment and an operation method for improving the rapid thermal processing productivity of wafers. The equipment includes at least one processing procedure module, a base body, a front end control interface and a rear end control interface, wherein each processing procedure module includes at least one processing procedure cavity, a loading end, an unloading end, a mechanical arm and a cooling device; the loading end and the unloading end are combined-type cassettes used for accommodating multiple-piece graphite bearing plates in a layered manner; and the multiple-piece graphite bearing plates are provided with carving grooves, so as to load wafers of various sizes. The cassettes are designed to be the multiple-piece graphite bearing plates capable of accommodating and loading wafers, so that operation of the mechanical arm during the processing procedure is reduced, and rapid thermal processing for a plurality of wafers can be performed at the same time, the productivity in unit tim</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Equipment and operation method for improving rapid thermal processing productivity of wafers |
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