Device and method for pressure bonding of parts

A device (10) for the pressure bonding of parts is provided with pressure bonding tools (12a, 12b) which pressure bond parts (Pa, Pb) mounted on a panel (W) to the panel using sheets (Sa, Sb). The pressure bonding tools are configured so as to be movable in a first direction (X-axis direction) perpe...

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Bibliographische Detailangaben

1. Verfasser:	KADOTA SYOZO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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