Microelectromechanical system having movable element integrated into leadframe-based package

A MEMS device (100) has an integrated circuit chip (101) and package comprising a leadframe-based plastic molded body (120) with an opening (122) through the thickness (121) of the body. A movable foil part (130) may be anchored in the body (120) and extend at least partially across the opening (122...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KRENIK WILLLIAM R, ZUNIGA-ORTIZ EDGAR ROLANDO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING
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