Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board
Gespeichert in:
| Hauptverfasser: | , , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | TSUIKI HIDEYASU OOKAWA MASAYA YOSHINO TOSHIZUMI SATO KUNIAKI HIDAKA TAKAHIRO |
| description | |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN102621810BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN102621810BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN102621810BB3</originalsourceid><addsrcrecordid>eNqNiz0KwkAQRtNYiHqHwTpCEkGsExQrsbAPa3ZiFrIzy86od_DUumJjZ_X98N40e54GVhYkceruCBHFEXTsA6eHKYfwS-CIHklz8KgDW-Aeeo7e0fUji0IwqhjfpiELIXKHIolJ3d66RIboSNHCw8U0L2yinWeT3oyCi2_OsuV-d24OKwzcogTTIaG2zbEsqk1Vbsuirtd_QS8QGk7A</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board</title><source>esp@cenet</source><creator>TSUIKI HIDEYASU ; OOKAWA MASAYA ; YOSHINO TOSHIZUMI ; SATO KUNIAKI ; HIDAKA TAKAHIRO</creator><creatorcontrib>TSUIKI HIDEYASU ; OOKAWA MASAYA ; YOSHINO TOSHIZUMI ; SATO KUNIAKI ; HIDAKA TAKAHIRO</creatorcontrib><language>chi ; eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CINEMATOGRAPHY ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; PRINTED CIRCUITS</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140528&DB=EPODOC&CC=CN&NR=102621810B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140528&DB=EPODOC&CC=CN&NR=102621810B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TSUIKI HIDEYASU</creatorcontrib><creatorcontrib>OOKAWA MASAYA</creatorcontrib><creatorcontrib>YOSHINO TOSHIZUMI</creatorcontrib><creatorcontrib>SATO KUNIAKI</creatorcontrib><creatorcontrib>HIDAKA TAKAHIRO</creatorcontrib><title>Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board</title><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNiz0KwkAQRtNYiHqHwTpCEkGsExQrsbAPa3ZiFrIzy86od_DUumJjZ_X98N40e54GVhYkceruCBHFEXTsA6eHKYfwS-CIHklz8KgDW-Aeeo7e0fUji0IwqhjfpiELIXKHIolJ3d66RIboSNHCw8U0L2yinWeT3oyCi2_OsuV-d24OKwzcogTTIaG2zbEsqk1Vbsuirtd_QS8QGk7A</recordid><startdate>20140528</startdate><enddate>20140528</enddate><creator>TSUIKI HIDEYASU</creator><creator>OOKAWA MASAYA</creator><creator>YOSHINO TOSHIZUMI</creator><creator>SATO KUNIAKI</creator><creator>HIDAKA TAKAHIRO</creator><scope>EVB</scope></search><sort><creationdate>20140528</creationdate><title>Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board</title><author>TSUIKI HIDEYASU ; OOKAWA MASAYA ; YOSHINO TOSHIZUMI ; SATO KUNIAKI ; HIDAKA TAKAHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN102621810BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2014</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>TSUIKI HIDEYASU</creatorcontrib><creatorcontrib>OOKAWA MASAYA</creatorcontrib><creatorcontrib>YOSHINO TOSHIZUMI</creatorcontrib><creatorcontrib>SATO KUNIAKI</creatorcontrib><creatorcontrib>HIDAKA TAKAHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TSUIKI HIDEYASU</au><au>OOKAWA MASAYA</au><au>YOSHINO TOSHIZUMI</au><au>SATO KUNIAKI</au><au>HIDAKA TAKAHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board</title><date>2014-05-28</date><risdate>2014</risdate><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN102621810BB |
| source | esp@cenet |
| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS |
| title | Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-23T07%3A34%3A57IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=TSUIKI%20HIDEYASU&rft.date=2014-05-28&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN102621810BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |