Wiring member and process for producing the same

Wiring member and process for producing the same

A wiring member including: a copper foil; a noise suppressing layer containing a metallic material or a conductive ceramic and having a thickness within the range of 5 to 200 nm; an organic polymer film; and an insulating adhesive layer, wherein the insulating adhesive layer is provided between the...

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Hauptverfasser: TAHARA KAZUTOKI, SAGA TSUTOMU, NEGISHI MITSUAKI, KAWAGUCHI TOSHIYUKI
Format: Patent
Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator TAHARA KAZUTOKI
SAGA TSUTOMU
NEGISHI MITSUAKI
KAWAGUCHI TOSHIYUKI
description A wiring member including: a copper foil; a noise suppressing layer containing a metallic material or a conductive ceramic and having a thickness within the range of 5 to 200 nm; an organic polymer film; and an insulating adhesive layer, wherein the insulating adhesive layer is provided between the organic polymer film formed on the noise suppressing layer and the copper foil, or between the noise suppressing layer formed on the organic polymer film and the copper foil. Further, there is provided a method for producing the wiring member.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN102612256BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN102612256BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN102612256BB3</originalsourceid><addsrcrecordid>eNrjZDAIzyzKzEtXyE3NTUotUkjMS1EoKMpPTi0uVkjLLwKxU0qTQQpKMlIVihNzU3kYWNMSc4pTeaE0N4OSm2uIs4duakF-fGpxQWJyal5qSbyzn6GBkZmhkZGpmZOTMVGKAJr7K4Q</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Wiring member and process for producing the same</title><source>esp@cenet</source><creator>TAHARA KAZUTOKI ; SAGA TSUTOMU ; NEGISHI MITSUAKI ; KAWAGUCHI TOSHIYUKI</creator><creatorcontrib>TAHARA KAZUTOKI ; SAGA TSUTOMU ; NEGISHI MITSUAKI ; KAWAGUCHI TOSHIYUKI</creatorcontrib><description>A wiring member including: a copper foil; a noise suppressing layer containing a metallic material or a conductive ceramic and having a thickness within the range of 5 to 200 nm; an organic polymer film; and an insulating adhesive layer, wherein the insulating adhesive layer is provided between the organic polymer film formed on the noise suppressing layer and the copper foil, or between the noise suppressing layer formed on the organic polymer film and the copper foil. Further, there is provided a method for producing the wiring member.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20150603&amp;DB=EPODOC&amp;CC=CN&amp;NR=102612256B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20150603&amp;DB=EPODOC&amp;CC=CN&amp;NR=102612256B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAHARA KAZUTOKI</creatorcontrib><creatorcontrib>SAGA TSUTOMU</creatorcontrib><creatorcontrib>NEGISHI MITSUAKI</creatorcontrib><creatorcontrib>KAWAGUCHI TOSHIYUKI</creatorcontrib><title>Wiring member and process for producing the same</title><description>A wiring member including: a copper foil; a noise suppressing layer containing a metallic material or a conductive ceramic and having a thickness within the range of 5 to 200 nm; an organic polymer film; and an insulating adhesive layer, wherein the insulating adhesive layer is provided between the organic polymer film formed on the noise suppressing layer and the copper foil, or between the noise suppressing layer formed on the organic polymer film and the copper foil. Further, there is provided a method for producing the wiring member.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAIzyzKzEtXyE3NTUotUkjMS1EoKMpPTi0uVkjLLwKxU0qTQQpKMlIVihNzU3kYWNMSc4pTeaE0N4OSm2uIs4duakF-fGpxQWJyal5qSbyzn6GBkZmhkZGpmZOTMVGKAJr7K4Q</recordid><startdate>20150603</startdate><enddate>20150603</enddate><creator>TAHARA KAZUTOKI</creator><creator>SAGA TSUTOMU</creator><creator>NEGISHI MITSUAKI</creator><creator>KAWAGUCHI TOSHIYUKI</creator><scope>EVB</scope></search><sort><creationdate>20150603</creationdate><title>Wiring member and process for producing the same</title><author>TAHARA KAZUTOKI ; SAGA TSUTOMU ; NEGISHI MITSUAKI ; KAWAGUCHI TOSHIYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN102612256BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2015</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>TAHARA KAZUTOKI</creatorcontrib><creatorcontrib>SAGA TSUTOMU</creatorcontrib><creatorcontrib>NEGISHI MITSUAKI</creatorcontrib><creatorcontrib>KAWAGUCHI TOSHIYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAHARA KAZUTOKI</au><au>SAGA TSUTOMU</au><au>NEGISHI MITSUAKI</au><au>KAWAGUCHI TOSHIYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Wiring member and process for producing the same</title><date>2015-06-03</date><risdate>2015</risdate><abstract>A wiring member including: a copper foil; a noise suppressing layer containing a metallic material or a conductive ceramic and having a thickness within the range of 5 to 200 nm; an organic polymer film; and an insulating adhesive layer, wherein the insulating adhesive layer is provided between the organic polymer film formed on the noise suppressing layer and the copper foil, or between the noise suppressing layer formed on the organic polymer film and the copper foil. Further, there is provided a method for producing the wiring member.</abstract><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Wiring member and process for producing the same
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-03T04%3A43%3A38IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=TAHARA%20KAZUTOKI&rft.date=2015-06-03&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN102612256BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true