LED packaging method and structure

LED packaging method and structure

An LED packaging method comprises the following steps of (1) fixing a reflecting bowl/fixing bracket on a circuit board, presetting a plurality of vent holes for a glue filling process, wherein a hollow part at which an LED chip is in direct contact with the circuit board is formed at the bottom of...

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Hauptverfasser: HUANG JIANMING, CHEN KAI, GUO DAN, FU SHAOQIN
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator HUANG JIANMING
CHEN KAI
GUO DAN
FU SHAOQIN
description An LED packaging method comprises the following steps of (1) fixing a reflecting bowl/fixing bracket on a circuit board, presetting a plurality of vent holes for a glue filling process, wherein a hollow part at which an LED chip is in direct contact with the circuit board is formed at the bottom of the reflecting bowl/fixing bracket; (2) directly loading and covering the LED chip on the hollow part of the reflecting bowl/fixing bracket, on the circuit board; (3) welding the anode and the cathode of the LED chip on the circuit board by an inner lead wire; and (4) coating a fluorescent powder layer on the surface of the LED chip, filling glue on the LED chip so as to completely cover the LED chip, the inner lead wire and the reflecting bowl/fixing bracket, or filling a mixture of fluorescent powder and glue on the LED chip so as to completely cover the LED chip, the inner lead wire and the reflecting bowl/fixing bracket. According to the method, the advantages of good thermal radiation property, simple structur
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title LED packaging method and structure
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