Package structure having mems element and fabrication method thereof

Package structure having mems element and fabrication method thereof

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Hauptverfasser: KE CHUNI, CHAN CHANG-YUEH, CHIU SHIH-KUANG, HUANG CHIEN-PING
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
SEMICONDUCTOR DEVICES
TRANSPORTING
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creator KE CHUNI
CHAN CHANG-YUEH
CHIU SHIH-KUANG
HUANG CHIEN-PING
description
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN102530824BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN102530824BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN102530824BB3</originalsourceid><addsrcrecordid>eNqNyrEOgjAURuEuDkZ9hxt3EwRNmEGNk3FwJ9fylzbSlrQXn18HH8DpDN9ZqtOd9YsHUJY0a5kTyPLbhYE8fCaM8AhCHHoy_ExOs7gYvig29iQWCdGs1cLwmLH5daW2l_Ojve4wxQ55Yo0A6drbviiPVVGXh6ap_po-NAYzfg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Package structure having mems element and fabrication method thereof</title><source>esp@cenet</source><creator>KE CHUNI ; CHAN CHANG-YUEH ; CHIU SHIH-KUANG ; HUANG CHIEN-PING</creator><creatorcontrib>KE CHUNI ; CHAN CHANG-YUEH ; CHIU SHIH-KUANG ; HUANG CHIEN-PING</creatorcontrib><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES ; MICROSTRUCTURAL TECHNOLOGY ; PERFORMING OPERATIONS ; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20150422&amp;DB=EPODOC&amp;CC=CN&amp;NR=102530824B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20150422&amp;DB=EPODOC&amp;CC=CN&amp;NR=102530824B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KE CHUNI</creatorcontrib><creatorcontrib>CHAN CHANG-YUEH</creatorcontrib><creatorcontrib>CHIU SHIH-KUANG</creatorcontrib><creatorcontrib>HUANG CHIEN-PING</creatorcontrib><title>Package structure having mems element and fabrication method thereof</title><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</subject><subject>MICROSTRUCTURAL TECHNOLOGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEOgjAURuEuDkZ9hxt3EwRNmEGNk3FwJ9fylzbSlrQXn18HH8DpDN9ZqtOd9YsHUJY0a5kTyPLbhYE8fCaM8AhCHHoy_ExOs7gYvig29iQWCdGs1cLwmLH5daW2l_Ojve4wxQ55Yo0A6drbviiPVVGXh6ap_po-NAYzfg</recordid><startdate>20150422</startdate><enddate>20150422</enddate><creator>KE CHUNI</creator><creator>CHAN CHANG-YUEH</creator><creator>CHIU SHIH-KUANG</creator><creator>HUANG CHIEN-PING</creator><scope>EVB</scope></search><sort><creationdate>20150422</creationdate><title>Package structure having mems element and fabrication method thereof</title><author>KE CHUNI ; CHAN CHANG-YUEH ; CHIU SHIH-KUANG ; HUANG CHIEN-PING</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN102530824BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2015</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</topic><topic>MICROSTRUCTURAL TECHNOLOGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>KE CHUNI</creatorcontrib><creatorcontrib>CHAN CHANG-YUEH</creatorcontrib><creatorcontrib>CHIU SHIH-KUANG</creatorcontrib><creatorcontrib>HUANG CHIEN-PING</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KE CHUNI</au><au>CHAN CHANG-YUEH</au><au>CHIU SHIH-KUANG</au><au>HUANG CHIEN-PING</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Package structure having mems element and fabrication method thereof</title><date>2015-04-22</date><risdate>2015</risdate><oa>free_for_read</oa></addata></record>
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recordid cdi_epo_espacenet_CN102530824BB
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
SEMICONDUCTOR DEVICES
TRANSPORTING
title Package structure having mems element and fabrication method thereof
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-25T14%3A16%3A53IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KE%20CHUNI&rft.date=2015-04-22&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN102530824BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true