Manufacturing method and process adjusting method for laminated wafer

Manufacturing method and process adjusting method for laminated wafer

The invention relates to a manufacturing method and a process adjusting method for a laminated wafer. The manufacturing method mainly comprises the following steps of: coating a first conducting layer on a surface of a support plate; coating an insulating layer on the surface of the support plate ti...

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1. Verfasser: HUANG QIJI
Format: Patent
Sprache:chi ; eng
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BASIC ELECTRIC ELEMENTS
CAPACITORS
CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator HUANG QIJI
description The invention relates to a manufacturing method and a process adjusting method for a laminated wafer. The manufacturing method mainly comprises the following steps of: coating a first conducting layer on a surface of a support plate; coating an insulating layer on the surface of the support plate till the insulating layer is covered on the first conducting layer; hitting the insulating layer with electron beams till a plurality of holes for exposing the first conducting layer are formed on the insulating layer; and coating a second conducting layer on a surface of the insulating layer and connecting the second conducting layer with the first conducting layer through the holes. By adopting the manufacturing method, electron beams at a hitting position can be controlled with a program, the contraposition trouble and procedure are eliminated, and the accuracy of a finished product can be further enhanced; and moreover, the manufacturing method is further applied to a process adjusting method, so that the aims of
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subjects BASIC ELECTRIC ELEMENTS
CAPACITORS
CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Manufacturing method and process adjusting method for laminated wafer
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