Printed wiring board, method for manufacturing same, and printed wiring board semi-finished-product-linked object

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SAITO TATSUYA, TAKAKURA MITSUAKI
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator SAITO TATSUYA
TAKAKURA MITSUAKI
description
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN102227957BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN102227957BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN102227957BB3</originalsourceid><addsrcrecordid>eNqNizsLwjAURrs4iPofLs4NaESKa4viJA7u5Ta5aaPNwzzw71vE0cHpO3DONy-e16BtIgkvPUEPncMgSzCUBidBuQAGbVYoUv74iIZKQCvB_zhCJKOZ0lbHgSTzwcksEhu1fUyl6-4k0rKYKRwjrb67KNan4605M_KupehRkKXUNpfthnNeHfZVXe_-it4ax0Q9</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Printed wiring board, method for manufacturing same, and printed wiring board semi-finished-product-linked object</title><source>esp@cenet</source><creator>SAITO TATSUYA ; TAKAKURA MITSUAKI</creator><creatorcontrib>SAITO TATSUYA ; TAKAKURA MITSUAKI</creatorcontrib><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20131016&amp;DB=EPODOC&amp;CC=CN&amp;NR=102227957B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20131016&amp;DB=EPODOC&amp;CC=CN&amp;NR=102227957B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SAITO TATSUYA</creatorcontrib><creatorcontrib>TAKAKURA MITSUAKI</creatorcontrib><title>Printed wiring board, method for manufacturing same, and printed wiring board semi-finished-product-linked object</title><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNizsLwjAURrs4iPofLs4NaESKa4viJA7u5Ta5aaPNwzzw71vE0cHpO3DONy-e16BtIgkvPUEPncMgSzCUBidBuQAGbVYoUv74iIZKQCvB_zhCJKOZ0lbHgSTzwcksEhu1fUyl6-4k0rKYKRwjrb67KNan4605M_KupehRkKXUNpfthnNeHfZVXe_-it4ax0Q9</recordid><startdate>20131016</startdate><enddate>20131016</enddate><creator>SAITO TATSUYA</creator><creator>TAKAKURA MITSUAKI</creator><scope>EVB</scope></search><sort><creationdate>20131016</creationdate><title>Printed wiring board, method for manufacturing same, and printed wiring board semi-finished-product-linked object</title><author>SAITO TATSUYA ; TAKAKURA MITSUAKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN102227957BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2013</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>SAITO TATSUYA</creatorcontrib><creatorcontrib>TAKAKURA MITSUAKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SAITO TATSUYA</au><au>TAKAKURA MITSUAKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Printed wiring board, method for manufacturing same, and printed wiring board semi-finished-product-linked object</title><date>2013-10-16</date><risdate>2013</risdate><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN102227957BB
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Printed wiring board, method for manufacturing same, and printed wiring board semi-finished-product-linked object
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-08T15%3A39%3A10IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SAITO%20TATSUYA&rft.date=2013-10-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN102227957BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true