Radiating module and electronic device employing same
The invention discloses a radiating module and an electronic device employing the same. The radiating module is applicable to the electronic device and comprises a circuit board, a plurality of heat-emitting elements and a plurality of heat-conducting base bodies, wherein the circuit board is provid...
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| creator | XIE YIHUA CHEN YAOQIN |
| description | The invention discloses a radiating module and an electronic device employing the same. The radiating module is applicable to the electronic device and comprises a circuit board, a plurality of heat-emitting elements and a plurality of heat-conducting base bodies, wherein the circuit board is provided with a first surface, a second surface and a plurality of hollowed through holes; the plurality of heat-conducting base bodies are provided with bases and side walls; the plurality of heat-conducting base bodies are correspondingly arranged inside the plurality of hollowed through holes; the plurality of heat-emitting elements are connected with the bases or the side walls of the plurality of heat-conducting base bodies to transmit the heat emitted by the plurality of heat-emitting elements from at least one of the sides and the bottoms down to the bottom of the second surface of the circuit body through the side walls and the bases of the plurality of heat-conducting base bodies so as to accelerate radiating. |
| format | Patent |
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The radiating module is applicable to the electronic device and comprises a circuit board, a plurality of heat-emitting elements and a plurality of heat-conducting base bodies, wherein the circuit board is provided with a first surface, a second surface and a plurality of hollowed through holes; the plurality of heat-conducting base bodies are provided with bases and side walls; the plurality of heat-conducting base bodies are correspondingly arranged inside the plurality of hollowed through holes; the plurality of heat-emitting elements are connected with the bases or the side walls of the plurality of heat-conducting base bodies to transmit the heat emitted by the plurality of heat-emitting elements from at least one of the sides and the bottoms down to the bottom of the second surface of the circuit body through the side walls and the bases of the plurality of heat-conducting base bodies so as to accelerate radiating.</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110921&DB=EPODOC&CC=CN&NR=102196709A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110921&DB=EPODOC&CC=CN&NR=102196709A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>XIE YIHUA</creatorcontrib><creatorcontrib>CHEN YAOQIN</creatorcontrib><title>Radiating module and electronic device employing same</title><description>The invention discloses a radiating module and an electronic device employing the same. 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| language | chi ; eng |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Radiating module and electronic device employing same |
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