Mems sensor
Provided is an MEMS sensor wherein especially a structure for bonding each supporting conductive section of a movable electrode section and a fixed electrode section, which are supported on a first substrate side, with a lead layer embedded in an insulating layer on the side of a second substrate wh...
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| creator | KOBAYASHI KIYOSHI TAKAHASHI TORU GOCHO HIDEKI |
| description | Provided is an MEMS sensor wherein especially a structure for bonding each supporting conductive section of a movable electrode section and a fixed electrode section, which are supported on a first substrate side, with a lead layer embedded in an insulating layer on the side of a second substrate which faces the first substrate with a space therebetween is improved. The MEMS sensor has a first substrate (1), a second substrate (2), and a functional layer, which is arranged between the substrates and has the movable electrode section, the fixed electrode section and the supporting conductive section. On the surface of the second substrate (2), a second insulating layer (30), a lead layer (35) and a connecting electrode section (32) which is electrically connected to the lead layer and is individually connected to each supporting conductive section are arranged. On the surface of the second insulating layer (30), a recessed section (37) which penetrates to reach even the surface of the lead layer is formed. The |
| format | Patent |
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The MEMS sensor has a first substrate (1), a second substrate (2), and a functional layer, which is arranged between the substrates and has the movable electrode section, the fixed electrode section and the supporting conductive section. On the surface of the second substrate (2), a second insulating layer (30), a lead layer (35) and a connecting electrode section (32) which is electrically connected to the lead layer and is individually connected to each supporting conductive section are arranged. On the surface of the second insulating layer (30), a recessed section (37) which penetrates to reach even the surface of the lead layer is formed. 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The MEMS sensor has a first substrate (1), a second substrate (2), and a functional layer, which is arranged between the substrates and has the movable electrode section, the fixed electrode section and the supporting conductive section. On the surface of the second substrate (2), a second insulating layer (30), a lead layer (35) and a connecting electrode section (32) which is electrically connected to the lead layer and is individually connected to each supporting conductive section are arranged. On the surface of the second insulating layer (30), a recessed section (37) which penetrates to reach even the surface of the lead layer is formed. 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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT MEASURING MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TESTING TRANSPORTING |
| title | Mems sensor |
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