LED bonding wire heating mold

The invention provides a light emitting diode (LED) bonding wire heating mold, which comprises a base bracket (1), a heating device (2) and a thermal insulation device (4), wherein the heating device (2) is arranged inside the base bracket (1) and protrudes upwards; the thermal insulation device (4)...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BI ZHANGDONG, ZHANG FANGHUI, LIANG TIANJING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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