Vacuum ion plating process
The invention relates to the technical field of electroplating, in particular to a vacuum ion plating process. The vacuum ion plating process is characterized in that cobalt-chromium alloy is selected as a target material and the plating process is completed in a vacuum environment, wherein the vacu...
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| creator | XU ZHENGCHENG |
| description | The invention relates to the technical field of electroplating, in particular to a vacuum ion plating process. The vacuum ion plating process is characterized in that cobalt-chromium alloy is selected as a target material and the plating process is completed in a vacuum environment, wherein the vacuum degree of the vacuum environment is required to be 0.2-0.9Pa, the temperature is 0-300 DEG C, the target current is 0-100A, the pulse bias voltage is 0-200V, and a reactant gas is argon; and the cobalt-chromium alloy target material is composed of the following components by weight percent: 40-85% of cobalt, 10-55% of chromium and the balance of trace element, wherein the trace element is one or more of molybdenum, nickel, iron, carbon, manganese, silicon, nitrogen, titanium, copper, aluminum and vanadium. The vacuum ion plating process is simple, scientific and reasonable, and is easy and convenient to operate, thus greatly improving the operation ratio and the maneuverability of the vacuum ion plating, caterin |
| format | Patent |
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The vacuum ion plating process is characterized in that cobalt-chromium alloy is selected as a target material and the plating process is completed in a vacuum environment, wherein the vacuum degree of the vacuum environment is required to be 0.2-0.9Pa, the temperature is 0-300 DEG C, the target current is 0-100A, the pulse bias voltage is 0-200V, and a reactant gas is argon; and the cobalt-chromium alloy target material is composed of the following components by weight percent: 40-85% of cobalt, 10-55% of chromium and the balance of trace element, wherein the trace element is one or more of molybdenum, nickel, iron, carbon, manganese, silicon, nitrogen, titanium, copper, aluminum and vanadium. The vacuum ion plating process is simple, scientific and reasonable, and is easy and convenient to operate, thus greatly improving the operation ratio and the maneuverability of the vacuum ion plating, caterin</description><language>chi ; eng</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110420&DB=EPODOC&CC=CN&NR=102021520A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110420&DB=EPODOC&CC=CN&NR=102021520A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>XU ZHENGCHENG</creatorcontrib><title>Vacuum ion plating process</title><description>The invention relates to the technical field of electroplating, in particular to a vacuum ion plating process. The vacuum ion plating process is characterized in that cobalt-chromium alloy is selected as a target material and the plating process is completed in a vacuum environment, wherein the vacuum degree of the vacuum environment is required to be 0.2-0.9Pa, the temperature is 0-300 DEG C, the target current is 0-100A, the pulse bias voltage is 0-200V, and a reactant gas is argon; and the cobalt-chromium alloy target material is composed of the following components by weight percent: 40-85% of cobalt, 10-55% of chromium and the balance of trace element, wherein the trace element is one or more of molybdenum, nickel, iron, carbon, manganese, silicon, nitrogen, titanium, copper, aluminum and vanadium. The vacuum ion plating process is simple, scientific and reasonable, and is easy and convenient to operate, thus greatly improving the operation ratio and the maneuverability of the vacuum ion plating, caterin</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAKS0wuLc1VyMzPUyjISSzJzEtXKCjKT04tLuZhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoYGRgZGhqZGBo7GxKgBAEZCIuA</recordid><startdate>20110420</startdate><enddate>20110420</enddate><creator>XU ZHENGCHENG</creator><scope>EVB</scope></search><sort><creationdate>20110420</creationdate><title>Vacuum ion plating process</title><author>XU ZHENGCHENG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN102021520A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2011</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>XU ZHENGCHENG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>XU ZHENGCHENG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Vacuum ion plating process</title><date>2011-04-20</date><risdate>2011</risdate><abstract>The invention relates to the technical field of electroplating, in particular to a vacuum ion plating process. The vacuum ion plating process is characterized in that cobalt-chromium alloy is selected as a target material and the plating process is completed in a vacuum environment, wherein the vacuum degree of the vacuum environment is required to be 0.2-0.9Pa, the temperature is 0-300 DEG C, the target current is 0-100A, the pulse bias voltage is 0-200V, and a reactant gas is argon; and the cobalt-chromium alloy target material is composed of the following components by weight percent: 40-85% of cobalt, 10-55% of chromium and the balance of trace element, wherein the trace element is one or more of molybdenum, nickel, iron, carbon, manganese, silicon, nitrogen, titanium, copper, aluminum and vanadium. The vacuum ion plating process is simple, scientific and reasonable, and is easy and convenient to operate, thus greatly improving the operation ratio and the maneuverability of the vacuum ion plating, caterin</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | Vacuum ion plating process |
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